Sn63Pb37 Tin Lead Solder Wire
Sn63Pb37 Tin Lead Solder Wire
An eutectic 63/37 tin-lead solder wire for precision electronic soldering, PCB repair and reliable manual assembly.

Eutectic solder wire for controlled electronics work
Sn63Pb37 changes directly between solid and liquid at 183°C, avoiding a broad pasty range. This supports fast wetting, short joint formation time and repeatable results in compatible leaded soldering processes.
Eutectic 183°C Alloy
A sharp melting transition supports fast soldering and controlled joint formation.
Reliable Wettability
Appropriate flux and surface preparation support smooth spreading on compatible finishes.
Precision Handling
Multiple wire diameters support fine electronics, general assembly and repair.
Flux-Cored Options
No-clean, rosin and selected custom flux systems can be reviewed.
Low Spatter Control
Consistent flux distribution helps reduce unnecessary spatter under suitable conditions.
Flexible Packaging
Tube and spool weights can be selected according to production requirements.
Product Specifications
Reference information for initial selection. Final alloy tolerance, diameter, flux content, packaging and process conditions should be confirmed before ordering.
Recommended Use
Recommended for PCB assembly, electronic repair, component installation, terminal soldering and general hand soldering where Sn63Pb37 is permitted.
Typical Applications
Application suitability depends on substrate finish, component design, flux selection, soldering equipment, process temperature and regulatory requirements.
Explore Tin Lead Solder Wire Options
Compare related alloys within the Jufeng tin-lead solder wire series.
Technical information is provided for product-selection reference. Tin-lead solder is regulated in many markets; confirm legal use, process suitability and reliability requirements before ordering.
Need a tin-lead solder wire specification?
Send the required alloy, wire diameter, flux type, spool weight, application and annual demand for technical review and quotation.
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