sn63pb37 solder wire

Sn63Pb37 Tin Lead Solder Wire

Sn63Pb37 Tin Lead Solder Wire
Sn63Pb37 tin lead solder wire is a eutectic solder alloy widely used in electronic soldering. With a sharp melting point of 183°C and available diameter from 0.3mm, it provides fast melting, smooth wetting, clean joint appearance, and reduced risk of cold solder joints during manual soldering, repair, and PCB assembly.
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Sn63Pb37 Tin Lead Solder Wire

An eutectic 63/37 tin-lead solder wire for precision electronic soldering, PCB repair and reliable manual assembly.

Sn63Pb37Eutectic Sn-Pb
183°CMelting point / range
0.30–3.00 mmWire diameter
Sn63Pb37 Tin Lead Solder Wire
Sn63Pb37 Tin Lead Solder Wire

Eutectic solder wire for controlled electronics work

Sn63Pb37 changes directly between solid and liquid at 183°C, avoiding a broad pasty range. This supports fast wetting, short joint formation time and repeatable results in compatible leaded soldering processes.

01

Eutectic 183°C Alloy

A sharp melting transition supports fast soldering and controlled joint formation.

02

Reliable Wettability

Appropriate flux and surface preparation support smooth spreading on compatible finishes.

03

Precision Handling

Multiple wire diameters support fine electronics, general assembly and repair.

04

Flux-Cored Options

No-clean, rosin and selected custom flux systems can be reviewed.

05

Low Spatter Control

Consistent flux distribution helps reduce unnecessary spatter under suitable conditions.

06

Flexible Packaging

Tube and spool weights can be selected according to production requirements.

Product Specifications

Reference information for initial selection. Final alloy tolerance, diameter, flux content, packaging and process conditions should be confirmed before ordering.

Recommended Use

Recommended for PCB assembly, electronic repair, component installation, terminal soldering and general hand soldering where Sn63Pb37 is permitted.

Product Name
Sn63Pb37 Tin Lead Solder Wire
Alloy Composition
Sn63Pb37
Alloy Family
Eutectic Sn-Pb
Melting Point / Range
183°C
Wire Diameter
0.30–3.00 mm
Wire Type
Flux-cored / solid optional
Flux Options
Rosin core / no-clean / selected custom formulations, subject to technical confirmation
Packaging
Tube or spool packaging; weight and carton arrangement subject to confirmed specification
Customization
Alloy tolerance, diameter, flux content, spool weight, label and packing available upon review
Compliance Note
Lead-containing alloy. Use only where permitted by applicable regulations and end-use requirements.

Typical Applications

Application suitability depends on substrate finish, component design, flux selection, soldering equipment, process temperature and regulatory requirements.

Application 01PCB Assembly
Application 02Electronics Repair
Application 03Component Installation
Application 04Terminal Soldering

Explore Tin Lead Solder Wire Options

Compare related alloys within the Jufeng tin-lead solder wire series.

Technical information is provided for product-selection reference. Tin-lead solder is regulated in many markets; confirm legal use, process suitability and reliability requirements before ordering.

Need a tin-lead solder wire specification?

Send the required alloy, wire diameter, flux type, spool weight, application and annual demand for technical review and quotation.

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