Joinspire Brings Advanced Electronic Interconnect Materials to CPCA Show Plus 2026
2026-09-17
How to Reduce Voids in HDI Via Filling
Voids in HDI via filling are commonly caused by trapped air, unsuitable paste rheology, incomplete filling, contamination and uncontrolled curing. Reducing them requires the material, via geometry, filling method and curing profile to be evaluated as one complete process.
2026-09-10
Flexible Conductive Copper Paste for Reliable Flexible Electronics
JL-CS01-FE conductive copper paste offers fast 160°C curing, high conductivity and bending resistance for PET, PI, sensors and printed circuits.
2026-09-07
Joinspire Has Moved to a New Office in Shenzhen
On the morning of August 25, 2026, Joinspire officially moved into our new office in Longhua District, Shenzhen. The relocation gives our team a more comfortable and efficient working environment while keeping us close to customers, partners and Shenzhen’s electronics industry ecosystem.
