Sn96.5Ag3.5 Lead-Free Solder Paste
Sn96.5Ag3.5 Lead-Free Solder Paste
Sn96.5Ag3.5 is a tin-silver lead-free solder paste supplied for controlled printing, dispensing, reflow and repair processes. Particle size, flux system and packaging can be reviewed according to the target assembly process.
Tin-silver lead-free solder paste
Designed for electronic assembly, precision soldering and silver-containing lead-free processes. Final suitability depends on PCB finish, component metallurgy, stencil design, deposition volume, reflow profile and reliability requirements.
Lead-Free Alloy
Sn96.5Ag3.5 supports lead-free soldering processes subject to the selected alloy and flux specification.
Controlled Melting Profile
Reference melting point or range: Approx. 221–222°C. Reflow settings must be validated on the actual assembly.
SMT Printability
Type 3, Type 4 and Type 5 powder options support selected stencil aperture and deposition requirements.
Reliable Wetting
Balanced flux activation supports solder spreading on compatible PCB and component finishes.
Multiple Packaging Options
Jar, syringe and selected cartridge supply can be reviewed according to the dispensing or printing process.
Process Customization
Particle size, flux system, packaging, labeling and selected alloy requirements can be discussed.
Product Specifications
Reference information for initial material selection. Final alloy tolerance, flux chemistry, viscosity, particle distribution, packaging and reflow conditions must be confirmed before ordering.
Recommended Use
Electronic assembly, precision soldering and silver-containing lead-free processes.
Typical Applications
Process validation should be completed with the actual stencil, PCB finish, component package, reflow equipment and reliability criteria.
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Need a solder paste specification?
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