Lead-Free Solder Paste
Lead-Free Solder Paste
A complete lead-free solder paste series for SMT printing, dispensing, electronic assembly and rework. Multiple SAC, tin-bismuth, tin-copper, tin-antimony and tin-silver alloy systems are available with particle-size and packaging options.
Solder paste options for controlled electronic assembly
Choose the alloy according to the required melting profile, assembly temperature, component sensitivity, regulatory requirements and reliability target. Particle size and flux chemistry should be matched to the stencil, dispensing method and reflow process.
Multiple Alloy Systems
Includes SAC / Sn-Bi / Sn-Cu / Sn-Sb and related specialty formulations.
Particle Size Options
Type 3, Type 4 and Type 5 powder options support different stencil and dispensing requirements.
Printing & Dispensing
Formulations can be reviewed for stencil printing, syringe dispensing and selected cartridge processes.
Flexible Packaging
Jar, syringe and selected cartridge supply options support sample evaluation and production use.
Available Product Models
Select a model to review its product description, reference melting profile, particle-size options and typical applications.
Sn95.7Ag3.8Cu0.5
Tin-silver-copper lead-free solder paste.
Sn50Bi50
Low-temperature tin-bismuth solder paste.
Sn95.5Ag3.8Cu0.7
Tin-silver-copper lead-free solder paste.
Sn97Cu3
High-temperature tin-copper solder paste.
Quick Technical Matrix
Reference data for initial comparison. Final specifications and process parameters must be confirmed before ordering.
Need help selecting a solder paste?
Send the alloy requirement, particle size, stencil or dispensing process, PCB finish, packaging and annual demand for technical review.
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