SAC305 lead-free solder paste
SAC305 lead-free solder paste
SAC305 lead-free solder paste
SAC305 lead-free solder paste
SAC305 lead-free solder paste

SAC305 Lead-Free Solder Paste Sn96.5Ag3.0Cu0.5 for SMT & SMD

SAC305 (Sn96.5Ag3.0Cu0.5)
SAC305 lead-free solder paste for SMT stencil printing, SMD assembly, PCB production, dispensing, and rework. Provides stable printing, reliable wetting, and consistent solder joints. Available in jars, syringes, and cartridges.
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SAC305 · Sn96.5Ag3.0Cu0.5 · No-clean
Request pricing, TDS and a solder paste recommendation for your SMT process
Request a Quote →WhatsApp: +86 183-1258-2917
217°C
melting point
T3 / T4 / T5
powder sizes
250 / 500 g
standard packaging
TDS / SDS / COA
documents on request
Built for a stable SMT process

SAC305 solder paste for stable stencil printing

Jufeng Sn96.5Ag3.0Cu0.5 is a lead-free, no-clean solder paste designed for SMT printing and reflow. Controlled viscosity, reliable print transfer and consistent wetting help support repeatable results in volume PCB assembly.

01

Stable printing

Controlled viscosity and shape recovery support consistent deposits in repeat SMT production.

02

Consistent wetting

The no-clean flux system supports reliable solder joints with low residue after reflow.

03

Process-matched options

We consider component pitch, stencil design, PCB finish, reflow profile and packaging.

Technical data

SAC305 key specifications

Request the TDS: +86 18312582917→
AlloySn96.5Ag3.0Cu0.5 (SAC305)
TypeLead-free, no-clean
Melting point217°C
Powder sizeT3, T4 or T5
Packaging250 g / 500 g; other options by agreement
ApplicationsSMT printing, BGA, QFN and fine-pitch assemblies
DocumentsTDS, SDS, COA, RoHS / REACH
SupplyLead time and Incoterms confirmed in the quotation
Application support

We will match SAC305 to your process

Share the key production details and we will recommend a suitable powder size, flux system and package.

Share Your Parameters →
01

Components and stencil

Minimum pitch, stencil thickness and printing method.

02

PCB surface finish

ENIG, HASL, OSP or another board finish.

03

Reflow profile

Your current profile or oven limitations.

04

Volume and packaging

Monthly usage, 250/500 g packaging and delivery destination.

Qualify before purchasing

Documents and samples for qualification

Request the technical package before your line trial. Quality and compliance documents are available for confirmed batches.

TDSTechnical data
SDSMaterial safety
COABatch quality record
RoHS / REACHCompliance support
Frequently asked questions

Before testing SAC305

Which powder size should I choose: T3, T4 or T5?

T3 is commonly used for standard SMT printing. T4 or T5 may be better for finer pitch, BGA and smaller stencil apertures. The final choice depends on aperture size and stencil thickness.

Can I request samples and technical documents?

Yes. Share your process, powder size and expected volume so we can confirm sample availability and provide the relevant TDS, SDS and COA.

Is SAC305 suitable for volume production?

Yes. We recommend validating print performance, open time and the reflow profile on your line before mass production.

How do I receive an accurate quotation?

Send your required powder size, packaging, monthly volume and delivery destination. We will quote based on the requested batch and shipping terms.

Request SAC305 pricing and samples

Send the powder size, packaging, volume and delivery destination for a project-specific response.

WhatsApp: +86 18312582917

Email:marketing002@jufengxi.com

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