Since 2006, Jufeng Solder has grown from a solder materials manufacturer into a supplier of solder, conductive and sintering materials for global electronics manufacturing.
2006
Founded in Shenzhen
100+
Countries & Regions
ISO
Quality System Support
IATF
Automotive Quality Support
R&D
Solder & Advanced Materials
Key Milestones
A cleaner timeline of Jufeng's growth from solder manufacturing to advanced conductive and sintering materials.
2006
Company Established
Shenzhen Jufeng Solder Co., Ltd. was established. SPECTRO testing equipment was introduced, and the company started the transition from lead-based to lead-free solder products.
2007
Overseas Export Started
Jufeng began exporting soldering products to overseas markets, laying the foundation for long-term international supply.
2008
Industry Association & Hong Kong Company
Jufeng joined the China Electronic Tin Solder Association. Jufeng Trading Limited was founded in Hong Kong to support international business development.
2009
European Market Development
RoHS and REACH-related certification support was strengthened, supporting Jufeng's entry into the European market.
2010
ISO 9001 Quality System
Jufeng was certified by ISO 9001:2008 and declared a non-use policy for conflict minerals.
2016
Sn-Bi Solder Wire Development
The company developed Sn-Bi series flux-cored solder wire, expanding product options for low-temperature soldering applications.
2017
Indium Series & Industry Memberships
Jufeng developed indium series flux-cored solder wire and joined ITA and IPC, strengthening industry exchange and technical development.
2018
ISO 9001:2015 & High-Tech Recognition
Jufeng was certified by ISO 9001:2015 and recognized as Shenzhen High Technology Expertise.
2019
Solder Powder & India Expansion
Jufeng joined SMTA, started developing low alpha solder powder, and established Jufeng Solder International Private Limited. KTE Jufeng Solder PVT Ltd. was founded in India for solder powder production.
2020
IATF 16949 & Distribution Cooperation
Jufeng was certified by IATF 16949:2016 and deepened cooperation with MG Chemicals, supporting distribution authorization in China and India.
2021
Power Module Die Attach Materials
The company focused on high-performance power module die attach materials, extending its portfolio toward advanced electronic packaging applications.
2022
Silver Sintering Paste Development
Jufeng launched pressure-assisted silver sintering paste and pressureless silver sintering paste for electronic packaging and power device applications.
2023
Specialized Enterprise & Mass Production Line
Jufeng was recognized as a Specialized and Sophisticated Enterprise and built a mass production line for silver sintering paste.
From Solder Materials to Advanced Electronic Materials
Jufeng Solder continues to support reliable interconnection for electronics assembly, semiconductor packaging and industrial manufacturing worldwide.
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