Sn63Pb37 Solder Ball / BGA Reballing
Sn63Pb37 Solder Ball / BGA Reballing
A widely used tin-lead solder sphere for BGA reballing, repair and semiconductor packaging projects that require the Sn63Pb37 alloy composition.
Sn63Pb37 solder sphere for BGA reballing and repair
Sn63Pb37 solder ball is supplied in solder sphere form for BGA reballing and related electronics work. It is commonly selected for tin-lead reballing and repair projects, while the final diameter, packaging and process conditions should be confirmed according to the product specification.
Sn63Pb37 Alloy
Uses the established tin-lead alloy composition for sphere-based soldering work.
BGA Reballing Use
Suitable for BGA reballing and similar semiconductor packaging tasks.
Repair-Friendly Selection
Can be considered for electronics repair and rework processes using Sn63Pb37.
Solder Sphere Supply
Provided as a solder ball format for controlled application.
Specification-Based Diameter
Ball size and package format are to be confirmed by product specification.
Process Review Recommended
Confirm flux compatibility and thermal profile before production use.
Product Specifications
Product and supply information for engineering review, purchasing reference and quotation discussion.
Recommended Use
Recommended for BGA reballing, semiconductor packaging, repair and rework operations where the Sn63Pb37 alloy system is required.
Typical Applications
Application suitability should be confirmed against your alloy requirement, solder sphere size, substrate condition and process profile.
Need Sn63Pb37 solder ball for reballing?
Contact Jufeng Solder to confirm the right diameter, packaging and process support for Sn63Pb37 solder sphere supply.
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