Sn59.9Bi40Cu0.1 Solder Powder / Tin Powder
Sn59.9Bi40Cu0.1 Solder Powder / Tin Powder
A specialty tin-bismuth-copper solder powder for custom solder paste development and electronic assembly requiring a defined intermediate melting point.
Specialty Sn-Bi-Cu powder for custom paste formulation
This multi-element alloy powder provides a tailored composition for customers evaluating reduced-temperature solder paste, printing and specialty joining processes.
Selectable Particle Grades
Available in Type 3, 4, 5 for suitable printing, dispensing and paste formulation requirements.
Stable Alloy Composition
Controlled alloy composition supports consistent melting behavior and repeatable material formulation.
Specialty alloy composition
Offers an additional alloy option between conventional low-temperature Sn-Bi and mainstream SAC systems.
Low Alpha Option
Selected low alpha or ultra-low alpha supply can be discussed; availability must be confirmed for the chosen alloy and particle grade.
Export Packaging
Standard supply is 5 kg per bag and 4 bags per box for practical storage and international shipment.
Custom Supply Support
Particle grade, alpha level, packaging and application requirements can be reviewed before quotation and sample evaluation.
Product Specifications
Core alloy, melting point, particle size and packaging information for engineering review and quotation.
Recommended Use
Recommended for custom solder paste formulation, reduced-temperature assembly trials, precision printing and specialty electronic materials.
Typical Applications
Final suitability should be confirmed against paste formulation, substrate finish, stencil design, deposition method, reflow profile and reliability requirements.
Need Sn59.9Bi40Cu0.1 solder powder for your formulation?
Contact Jufeng Solder for particle size confirmation, low alpha options, sample evaluation, packaging and quotation support.
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