Sn2.5Pb95Ag2.5 Leaded Solder Paste
Sn2.5Pb95Ag2.5 Leaded Solder Paste
Sn2.5Pb95Ag2.5 is a high-lead silver solder paste supplied for controlled printing, dispensing, reflow and repair processes. Particle size, flux system and packaging can be reviewed according to the target assembly process.
High-lead silver solder paste
Designed for high-temperature component attachment and specialty electronic joining. Final suitability depends on PCB finish, component metallurgy, stencil design, deposition volume, reflow profile and reliability requirements.
Defined Alloy System
Sn2.5Pb95Ag2.5 composition for applications requiring a specific leaded solder profile.
Controlled Melting Behavior
Reference melting point or range: 288–298°C. Final process settings should be confirmed by trial.
Printing & Dispensing
Type 3, Type 4 and Type 5 powder options support selected stencil printing and dispensing requirements.
Stable Wetting
Appropriate flux selection and surface preparation support consistent wetting on compatible finishes.
Jar & Syringe Supply
Standard jar and syringe packaging options are available for production, repair and evaluation.
Custom Process Support
Flux system, powder type, package size and labeling can be reviewed for qualified projects.
Product Specifications
Reference information for initial material selection. Final alloy tolerance, flux chemistry, viscosity, particle distribution, packaging and reflow conditions must be confirmed before ordering.
Recommended Use
High-temperature component attachment and specialty electronic joining.
Typical Applications
Process validation should be completed with the actual stencil, PCB finish, component package, reflow equipment and reliability criteria.
Explore Related Solder Paste Models
Compare related alloys within the Jufeng leaded solder paste series.
Need a solder paste specification?
Send the target alloy, particle size, packaging, stencil or dispensing process, PCB finish and annual demand for technical review and quotation.
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