Sn62.8Pb36.8Ag0.4 Leaded Solder Paste
Sn62.8Pb36.8Ag0.4 Leaded Solder Paste
Sn62.8Pb36.8Ag0.4 leaded solder paste is designed for controlled soldering processes requiring reliable printing, dispensing, and stable wetting performance.
Quantity
Sn62.8Pb36.8Ag0.4
Leaded Solder Paste
Sn62.8Pb36.8Ag0.4 leaded solder paste is designed for controlled soldering processes requiring reliable printing, dispensing, and stable wetting performance.
Alloy
Sn62.8Pb36.8Ag0.4
Melting Point
183°C
Particle Size
Type 3, Type 4, Type 5
Packing
Jar / Syringe
Product Overview
Leaded solder paste for stable assembly performance.
This model is part of the Jufeng leaded solder paste series, supplied for jar or syringe packing according to production and sampling requirements.
Process Ready
Suitable for printing, dispensing, repair, and specialty soldering processes.
Particle Size Options
Available in Type 3, Type 4, and Type 5 particle size options.
Flexible Packing
Jar and syringe packing available for different production volumes.
Technical Data
Sn62.8Pb36.8Ag0.4 specifications.
| Item | Specification | Description |
|---|---|---|
| Product Name | Sn62.8Pb36.8Ag0.4 Leaded Solder Paste | Leaded solder paste alloy |
| Melting Point | 183°C | Process temperature reference |
| Particle Size | Type 3, Type 4, Type 5 | Suitable for printing or dispensing process selection |
| Packaging | 250g / 500g per jar; 20 bottles per carton (34.5 × 27.5 × 23.5 cm); 10cc / 30cc / 100g / 200g per syringe | Jar and syringe packaging available |
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