Non Pressure Sinter Silver Paste PL-500LT
PL-500LT Low-Temperature Pressureless Silver Sinter Paste
A low-temperature pressureless silver sinter paste for high-power device bonding, offering high thermal conductivity, stable dispensing and multiple selectable curing profiles.
Low-temperature pressureless silver bonding for power devices
PL-500LT provides a pressureless silver-sintering route for power semiconductor and optoelectronic applications. The material supports regular, fast and lower-temperature heating profiles according to package and production requirements.
Pressureless Sintering
Designed for die attachment without external sintering pressure.
High Heat Dissipation
Specified thermal conductivity exceeds 200 W/m·K.
Low Electrical Resistance
Specified resistivity is below 6 μΩ·cm.
High Shear Performance
Developed for mechanically reliable power-device bond layers.
Flexible Heating Profiles
TDS provides regular, fast and low-temperature profile options.
Cold-Storage Stability
Specified shelf life is six months when stored under the required frozen conditions.
Product Specifications
Technical data for engineering evaluation. Final process settings should be confirmed against the selected substrate, package dimensions and production equipment.
Recommended Use
Recommended for pressureless bonding of power semiconductors, high-power LEDs and related devices. Select the heating profile according to substrate finish, die size and production requirements; bare-copper use should be confirmed with the final product specification and atmosphere.
Typical Applications
Application suitability should be confirmed against substrate finish, material dimensions, processing atmosphere and reliability requirements.
Need PL-500LT for low-temperature pressureless sintering?
Send the substrate finish, die size, target bond line and oven capability for profile and sample evaluation.
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