Low Alpha Solder Materials
Low Alpha Solder Powder
A low- and ultra-low-alpha solder powder for high-density semiconductor packaging, with lead-free or high-lead alloy options and T3 to T6 powder types.
Low-alpha solder powder for high-density packaging systems
Jufeng low-alpha solder powder is developed for high-performance semiconductor devices that require controlled alpha-particle emissions. The material supports selected lead-free and high-lead alloy systems, with powder types covering T3, T4, T5 and T6.
Low-Alpha Grade
Available with an alpha-emission target below 0.01 cph/cm².
Ultra-Low-Alpha Grade
Available with an alpha-emission target below 0.002 cph/cm².
T3 to T6 Powder Types
Multiple particle-size classifications support different packaging processes.
High Powder Sphericity
Designed with spherical powder morphology for process consistency.
Narrow Size Distribution
Controlled particle distribution supports precision printing and deposition.
Low Oxygen and High Purity
Material design emphasizes low oxygen content and high chemical purity.
Product Specifications
Technical and supply information for engineering review, purchasing evaluation and quotation discussion.
Recommended Use
Recommended for SiP, flip chip, mobile communications, IoT devices, automotive infotainment and high-performance computing applications that require low-alpha packaging materials. Final alloy, powder type and emission grade must be confirmed for the selected process.
Typical Applications
Application suitability should be confirmed against the selected specification, operating conditions and process requirements.
Need low-alpha solder powder for packaging?
Contact Jufeng Solder to confirm the alpha grade, alloy system, T3–T6 powder type, packaging and process requirements.
Want the product? Contact us!
