JF0805 Solder Preform
JF0805 Solder Preform
JF0805 solder preform is supplied for precision electronic assembly, solder volume control, automated placement, and customized soldering processes. Standard dimensions are available, with OEM customization supported for alloy, shape, flux coating, and packaging.
Pre-cut solder volume for precise assembly control.
Solder preforms help provide a defined solder volume, consistent placement, and stable solder joint formation. This model can be supplied in standard dimensions or customized according to alloy, shape, size, flux coating, and packaging requirements.
Precise Solder Volume
Standardized size and volume support controlled solder joint formation.
OEM Customization
Alloy, shape, size, and coating can be customized according to project needs.
Flux Coating Option
Pure alloy or flux coating options support different soldering processes.
Flexible Packaging
Bottle, waffle, and tape-and-reel packaging are available.
Quick specification
| Product Name | JF0805 Solder Preform |
| Size | 2.03 × 1.27 × 0.76 mm / 0.079 × 0.050 × 0.028 inch |
| Volume | 1.960 mm³ / 0.000119 inch³ |
| 7 Inch Scroll | 3,000 pcs |
| 13 Inch Scroll | 15,000 pcs |
| Carrier | Plastic |
| Packaging | Bottle / Waffle / Tape and Reel; Paper or plastic package; 7 inch or 13 inch. Different package options are available for different pieces. |
For precision solder volume control.
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