JF-PMAg02 Pressure Sinter Silver Paste
JF-PMAg02
Pressure Sinter Silver Paste
JF-PMAg02 is a silver paste suitable for pressure sintering processes. It delivers excellent conductivity, stable long-printing operation and dense sintered silver layers for high-reliability power device chip bonding.
Standard die attach solution for power modules.
JF-PMAg02 maintains operation stability during long printing processes and forms a uniform, dense silver layer after pressure sintering.
It is designed to provide high reliability and high thermal conductivity for power device chip bonding, with REACH and RoHS compliance.
Pressure Sintering
Designed for pressure sintering processes in power device bonding.
High Conductivity
High thermal and electrical conductivity for reliable chip attachment.
High Shear Strength
Supports strong bonding reliability for power semiconductor applications.
REACH & RoHS
Compliant with REACH and RoHS requirements.
Built for standard die attach in power modules.
Suitable for pressure sintering applications where thermal conductivity, electrical conductivity and dense sintered silver layers are required.
Key data for engineering review and sample approval.
The following parameters support pressure sintering process selection, storage planning and reliability evaluation.
| Item | Data | Remark |
|---|---|---|
| Viscosity | 3 ± 1 Pa·s | @20rpm tested by viscometer |
| Density | 3.5 g/cm³ | Before sintering |
| Solid Content | 70–75% | TGA |
| CTE | 14 ppm/K | TMA |
| Thermal Conductivity | >200 W/m·K | Laser flash |
| Resistivity | <6 μΩ·cm | Four-point probe |
| Elastic | 20–30 GPa | ASTM E2546 |
| Melting Point | 961℃ | DSC |
| Applicable Surface | Ag / Au / Cu | — |
| Work Life | 8 hours | @19–25℃ |
| Storage Temperature | -20℃ to 0℃ / 0℃ to 10℃ | Freezing or refrigeration |
| Shelf Life | 6 months | — |
Storage, thawing and mixing guidance.
Keep temperature recovery and mixing conditions clear before opening, printing or bonding. Tiny operational details, annoyingly, are where reliability lives.
Storage
Store at -20℃ to 0℃ or 0℃ to 10℃. Avoid direct sunlight and high humidity.
Thawing from Freezer
Thaw at room temperature around 25℃ for 4 hours before opening.
Thawing from Refrigerator
Thaw at room temperature around 25℃ for 2 hours before opening.
Mixing
Recommended vacuum mixing: 800–1200 rpm for 90–180 seconds.
Recommended process conditions.
General recommendations for chip sizes of 10mm × 10mm and smaller. Adjust according to application environment, chip size and materials.
Stencil Printing
Pressure: 2–5kg
Demoulding distance: 2mm
Demoulding speed: 0.5mm/s
Preheating
Temperature: 120–130℃
Time: 15–20 minutes
Atmosphere: Air for Ag / Au, N₂ for Cu
Die Bonding
Temperature: 130–160℃
Pressure: 3–6kg
Time: 0.5s
Pressure Sintering
Top / bottom sintering temp: 250–270℃
Pressure: 10–20MPa
Time: 3–5 minutes
Atmosphere: Air for Ag / Au, N₂ for Cu
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