Sn85In10Ag5 Lead-Free Indium Solder Wire

Sn85In10Ag5
Sn85In10Ag5 lead-free indium solder wire is a silver-containing tin-indium solder wire for higher service-temperature requirements. It is suitable for electronics assembly, low-temperature soldering, rework, bonding, and customized soldering processes where alloy composition, wire diameter, and flux form need to be matched carefully.
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Sn85In10Ag5 Lead-Free Indium Solder Wire

A tin-rich indium-silver lead-free solder wire with a 200°C melting point for durable electronic joints and specialized assembly.

Sn85In10Ag5Tin-indium-silver
200°CMelting point
2 Wire FormsSolid or flux-cored
Sn85In10Ag5 Lead-Free Indium Solder Wire
Sn85In10Ag5 Indium Solder Wire

Tin-rich Sn-In-Ag wire for durable lead-free assembly

Sn85In10Ag5 combines a tin-rich base with indium and silver additions. Its 200°C melting point positions it between low-temperature indium alloys and conventional high-temperature lead-free systems, making it useful for specialized electronic and electrical joints.

01

200°C Melting Point

Provides a defined process point below many conventional high-temperature alloys.

02

Tin-Rich Composition

Supports familiar tin-based soldering behavior for electronic assembly.

03

Indium Modification

Indium contributes to the alloy’s selected thermal and mechanical behavior.

04

Silver Addition

Silver supports joint performance in demanding applications.

05

Solid or Flux-Cored

Choose separate flux control or convenient built-in flux depending on diameter.

06

Industrial Packaging

Spool packaging supports testing, maintenance and regular production.

Product Specifications

Core alloy, wire form and packaging information for engineering review and quotation.

Recommended Use

Recommended for industrial electronics, electrical connections, component bonding and specialized lead-free assembly.

Product Name
Sn85In10Ag5 Lead-Free Indium Solder Wire
Alloy Composition
Sn85 / In10 / Ag5
Alloy Family
Tin-Indium-Silver
Melting Point
200°C
Wire Diameter
>0.6 mm solid; >1.0 mm flux-cored
Wire Form
Solid or flux-cored
Flux Option
Flux-cored option available above 1.0 mm
Packaging
100 g or 200 g per spool; 2 kg per box
Typical Applications
Industrial Electronics, Electrical Connections, Component Bonding, Specialized Assembly

Typical Applications

Application suitability should be confirmed against substrate finish, flux chemistry, heating profile and reliability requirements.

Application 01Industrial Electronics
Application 02Electrical Connections
Application 03Component Bonding
Application 04Specialized Assembly
View the complete lead-free indium solder wire series →

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Contact Jufeng Solder for alloy confirmation, diameter options, sample evaluation, packaging and quotation support.

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