Sn77.2In20Ag2.8 Lead-Free Indium Solder Wire

Sn77.2In20Ag2.8
Sn77.2In20Ag2.8 lead-free indium solder wire is a tin-indium-silver solder wire for applications requiring balanced melting behavior and joint reliability. It is suitable for electronics assembly, low-temperature soldering, rework, bonding, and customized soldering processes where alloy composition, wire diameter, and flux form need to be matched carefully.
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Sn77.2In20Ag2.8 Lead-Free Indium Solder Wire

A tin-indium-silver lead-free solder wire with a 175–187°C melting range for electronics assembly requiring lower processing temperature and reliable joints.

Sn77.2In20Ag2.8Tin-indium-silver
175–187°CMelting range
Lead-FreeReliable joining
Sn77.2In20Ag2.8 Lead-Free Indium Solder Wire
Sn77.2In20Ag2.8 Indium Solder Wire

Sn-In-Ag solder wire with a controlled mid-low melting range

Sn77.2In20Ag2.8 offers a lower processing range than common SAC alloys while retaining a tin-rich composition and silver addition. It is suitable for electronics assembly programs that need reduced thermal exposure together with stable joint performance.

01

175–187°C Melting Range

Supports assembly below the typical process temperature of standard SAC solder.

02

Tin-Rich Matrix

Provides tin-based soldering behavior modified by indium and silver.

03

Silver-Containing Alloy

Silver contributes to the selected balance of solderability and joint properties.

04

Reduced Thermal Exposure

Useful for assemblies that cannot tolerate conventional high-temperature reflow.

05

Solid Wire Format

Allows separate selection of flux chemistry for the target surfaces.

06

Production Packaging

Available in spool packaging for evaluation and routine production use.

Product Specifications

Core alloy, wire form and packaging information for engineering review and quotation.

Recommended Use

Recommended for electronic modules, temperature-sensitive assembly, connectors and specialized component bonding.

Product Name
Sn77.2In20Ag2.8 Lead-Free Indium Solder Wire
Alloy Composition
Sn77.2 / In20 / Ag2.8
Alloy Family
Tin-Indium-Silver
Melting Point
175–187°C
Wire Diameter
>1.0 mm
Wire Form
Solid wire
Flux Option
No built-in flux core
Packaging
100 g or 200 g per spool; 2 kg per box
Typical Applications
Electronic Modules, Sensitive Assemblies, Precision Connectors, Component Bonding

Typical Applications

Application suitability should be confirmed against substrate finish, flux chemistry, heating profile and reliability requirements.

Application 01Electronic Modules
Application 02Sensitive Assemblies
Application 03Precision Connectors
Application 04Component Bonding
View the complete lead-free indium solder wire series →

Need Sn77.2In20Ag2.8 solder wire for your process?

Contact Jufeng Solder for alloy confirmation, diameter options, sample evaluation, packaging and quotation support.

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