Sn62Pb36Ag2 Solder Ball / BGA Reballing
Sn62Pb36Ag2 Solder Ball / BGA Reballing
A silver-bearing tin-lead solder sphere for BGA reballing, electronics repair and semiconductor packaging processes that require a tin-lead alloy option.
Silver-bearing tin-lead solder sphere for reballing applications
Sn62Pb36Ag2 solder ball is a tin-lead-silver alloy supplied in solder sphere form for BGA reballing and related assembly work. It is suitable for engineering evaluation where a silver-bearing tin-lead alloy is preferred and the final diameter and process settings are confirmed by product specification.
Tin-Lead-Silver Alloy
Combines tin, lead and silver in a dedicated solder sphere composition.
BGA Reballing Application
Used in BGA reballing and related sphere-based joining work.
Repair and Rework Support
Can be considered for repair, rework and packaging processes using tin-lead alloy systems.
Solder Ball Format
Provided as solder ball material for controlled application methods.
Specification-Based Selection
Diameter and packaging should be selected according to product specification.
Application Confirmation
Final flux choice and processing conditions should be reviewed before use.
Product Specifications
Product and supply information for engineering review, purchasing reference and quotation discussion.
Recommended Use
Recommended for BGA reballing, semiconductor packaging, electronics repair and related assembly projects where a silver-bearing tin-lead solder sphere is required.
Typical Applications
Application suitability should be confirmed against your alloy requirement, solder sphere size, substrate condition and process profile.
Need Sn62Pb36Ag2 solder ball for your work?
Contact Jufeng Solder to confirm the solder sphere specification, diameter and packaging for your selected process.
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