Sn55Bi42In3 Lead-Free Indium Solder Wire

Sn55Bi42In3
Sn55Bi42In3 lead-free indium solder wire is a tin-bismuth-indium solder wire for low-temperature soldering and rework. It is suitable for electronics assembly, low-temperature soldering, rework, bonding, and customized soldering processes where alloy composition, wire diameter, and flux form need to be matched carefully.
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Sn55Bi42In3 Lead-Free Indium Solder Wire

A tin-bismuth-indium lead-free solder wire for low-temperature electronics assembly, repair and rework where reduced thermal exposure is important.

Sn55Bi42In3Low-temperature alloy
2 Wire FormsSolid or flux-cored
Lead-FreeRepair and rework
Sn55Bi42In3 Lead-Free Indium Solder Wire
Sn55Bi42In3 Indium Solder Wire

Low-temperature SnBiIn solder wire for repair and assembly

Sn55Bi42In3 combines tin, bismuth and indium for low-temperature soldering applications. It is available in solid and flux-cored formats, giving engineers flexibility for precision rework, manual soldering and assemblies that require reduced heat input.

01

Low-Temperature Processing

Supports soldering processes designed to limit thermal exposure.

02

Solid Wire Option

Suitable when flux chemistry must be selected and applied separately.

03

Flux-Cored Option

Built-in flux is available for larger wire diameters and convenient operation.

04

Reduced Heat Input

Useful for temperature-sensitive components, boards and secondary soldering.

05

Controlled Rework

Well suited to repair stations, engineering trials and small-batch assembly.

06

Flexible Packaging

Spool and box options support samples as well as regular production use.

Product Specifications

Core alloy, wire form and packaging information for engineering review and quotation.

Recommended Use

Recommended for PCB repair, SMT rework, secondary soldering and temperature-sensitive electronic assemblies.

Product Name
Sn55Bi42In3 Lead-Free Indium Solder Wire
Alloy Composition
Sn55 / Bi42 / In3
Alloy Family
Tin-Bismuth-Indium
Melting Point
Low-temperature alloy; confirm by TDS
Wire Diameter
>0.5 mm solid; >0.8 mm flux-cored
Wire Form
Solid or flux-cored
Flux Option
Flux-cored option available above 0.8 mm
Packaging
100 g or 200 g per spool; 2 kg per box
Typical Applications
PCB Repair, SMT Rework, Secondary Soldering, Sensitive Components

Typical Applications

Application suitability should be confirmed against substrate finish, flux chemistry, heating profile and reliability requirements.

Application 01PCB Repair
Application 02SMT Rework
Application 03Secondary Soldering
Application 04Sensitive Components
View the complete lead-free indium solder wire series →

Need Sn55Bi42In3 solder wire for your process?

Contact Jufeng Solder for alloy confirmation, diameter options, sample evaluation, packaging and quotation support.

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