Sn48In52 Lead-Free Indium Solder Wire

Sn48In52

Sn48In52 lead-free indium solder wire is a low-temperature tin-indium solder wire for temperature-sensitive assembly. It is suitable for electronics assembly, low-temperature soldering, rework, bonding, and customized soldering processes where alloy composition, wire diameter, and flux form need to be matched carefully.

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Sn48In52 Lead-Free Indium Solder Wire

A low-temperature tin-indium solder wire with a 118°C melting point for heat-sensitive electronics, secondary soldering and precision bonding.

Sn48In52Tin-indium alloy

118°CLow melting point

2 Wire FormsSolid or flux-cored

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Sn48In52 Indium Solder Wire

118°C tin-indium solder wire for heat-sensitive assembly

Sn48In52 is a low-melting tin-indium alloy designed for soldering processes that must limit thermal exposure. The alloy is available in solid wire and, at larger diameters, flux-cored form for convenient manual soldering and production use.

118°C Melting Point

Helps reduce thermal stress on sensitive components and substrates.

Tin-Indium Alloy

Provides low-temperature soldering with a balanced Sn-In composition.

Solid Wire Option

Supports separate flux selection for specialized surfaces and processes.

Flux-Cored Availability

Larger diameters can be supplied with built-in flux for convenient operation.

Secondary Soldering

Suitable for staged assembly where earlier joints must remain undisturbed.

Precision Rework

Useful for controlled repair of compact and heat-sensitive electronics.

Product Specifications

Core alloy, wire form and packaging information for engineering review and quotation.

Recommended Use

Recommended for secondary soldering, low-temperature rework, sensors, optical modules and temperature-sensitive electronics.

Product Name

Sn48In52 Lead-Free Indium Solder Wire

Alloy Composition

Sn48 / In52

Alloy Family

Tin-Indium

Melting Point

118°C

Wire Diameter

>0.6 mm solid; >1.2 mm flux-cored

Wire Form

Solid or flux-cored

Flux Option

Flux-cored option available above 1.2 mm

Packaging

100 g or 200 g per spool; 2 kg per box

Typical Applications

Secondary Soldering, Low-Temperature Rework, Optical Modules, Sensitive Electronics

Typical Applications

Application suitability should be confirmed against substrate finish, flux chemistry, heating profile and reliability requirements.

Application 01Secondary Soldering

Application 02Low-Temperature Rework

Application 03Optical Modules

Application 04Sensitive Electronics

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