Sn46In52.2Zn1.8 Lead-Free Indium Solder Wire

Sn46In52.2Zn1.8
Sn46In52.2Zn1.8 lead-free indium solder wire is a low-temperature tin-indium-zinc solder wire for controlled joining processes. It is suitable for electronics assembly, low-temperature soldering, rework, bonding, and customized soldering processes where alloy composition, wire diameter, and flux form need to be matched carefully.
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Sn46In52.2Zn1.8 Lead-Free Indium Solder Wire

A low-temperature tin-indium-zinc lead-free solder wire with a 108°C melting point for specialized bonding and temperature-sensitive assembly.

Sn46In52.2Zn1.8Tin-indium-zinc
108°CLow melting point
Solid WireControlled flux choice
Sn46In52.2Zn1.8 Lead-Free Indium Solder Wire
Sn46In52.2Zn1.8 Indium Solder Wire

108°C Sn-In-Zn wire for specialized low-temperature bonding

Sn46In52.2Zn1.8 combines tin and indium with a controlled zinc addition. The 108°C melting point supports low-temperature assembly, while the solid wire format allows engineers to select flux chemistry according to the substrate and surface condition.

01

108°C Melting Point

Supports low-temperature soldering with reduced heat input.

02

Sn-In-Zn Composition

Zinc addition provides a specialized alternative within the indium alloy range.

03

Solid Wire Format

Allows independent control of flux chemistry and application quantity.

04

Sensitive Assembly Use

Suitable for selected components and substrates with limited heat tolerance.

05

Specialty Surface Evaluation

Flux and surface preparation should be matched to the target material.

06

Production Packaging

Available in practical spool and box formats for testing and supply.

Product Specifications

Core alloy, wire form and packaging information for engineering review and quotation.

Recommended Use

Recommended for specialty bonding, low-temperature electronics, sensors and selected temperature-sensitive assemblies.

Product Name
Sn46In52.2Zn1.8 Lead-Free Indium Solder Wire
Alloy Composition
Sn46 / In52.2 / Zn1.8
Alloy Family
Tin-Indium-Zinc
Melting Point
108°C
Wire Diameter
>0.6 mm
Wire Form
Solid wire
Flux Option
External flux selected by process
Packaging
100 g or 200 g per spool; 2 kg per box
Typical Applications
Specialty Bonding, Low-Temperature Electronics, Sensors, Sensitive Assemblies

Typical Applications

Application suitability should be confirmed against substrate finish, flux chemistry, heating profile and reliability requirements.

Application 01Specialty Bonding
Application 02Low-Temperature Electronics
Application 03Sensors
Application 04Sensitive Assemblies
View the complete lead-free indium solder wire series →

Need Sn46In52.2Zn1.8 solder wire for your process?

Contact Jufeng Solder for alloy confirmation, diameter options, sample evaluation, packaging and quotation support.

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