Sn42Bi57Ag1 Solder Ball / BGA Reballing
Sn42Bi57Ag1 Solder Ball / BGA Reballing
A low-temperature lead-free solder sphere for BGA reballing and heat-sensitive electronics work using the Sn42Bi57Ag1 alloy composition.
Low-temperature lead-free solder sphere for heat-sensitive reballing
Sn42Bi57Ag1 solder ball is a low-temperature lead-free solder sphere intended for BGA reballing and related precision assembly where reduced thermal exposure may be important. Final diameter, packaging and application conditions should be confirmed according to the selected product specification.
Tin-Bismuth-Silver Alloy
Uses the Sn42Bi57Ag1 composition for specialized solder sphere applications.
Low-Temperature Selection
Can be considered where lower process temperature is an important factor.
Lead-Free Option
Suitable for applications requiring a lead-free solder ball choice.
BGA Reballing Focus
Designed for BGA reballing and related solder sphere assembly work.
Specification-Based Selection
Diameter, packaging and processing details should be confirmed by product specification.
Heat-Sensitive Process Review
Review substrate, flux and thermal profile requirements before use.
Product Specifications
Product and supply information for engineering review, purchasing reference and quotation discussion.
Recommended Use
Recommended for low-temperature BGA reballing, heat-sensitive electronics assembly, semiconductor packaging and process evaluation where the Sn42Bi57Ag1 alloy is required.
Typical Applications
Application suitability should be confirmed against your alloy requirement, solder sphere size, substrate condition and process profile.
Need low-temperature Sn42Bi57Ag1 solder ball?
Contact Jufeng Solder to confirm the alloy selection, diameter and packaging for your low-temperature reballing project.
Want the product? Contact us!
