Sn16.5Bi32.5In51 Lead-Free Indium Solder Wire

Sn16.5Bi32.5In51
Sn16.5Bi32.5In51 lead-free indium solder wire is a ultra-low-temperature solder wire for highly heat-sensitive applications. It is suitable for electronics assembly, low-temperature soldering, rework, bonding, and customized soldering processes where alloy composition, wire diameter, and flux form need to be matched carefully.
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Sn16.5Bi32.5In51 Lead-Free Indium Solder Wire

An ultra-low-temperature tin-bismuth-indium solder wire with a 60°C melting point for thermal protection, fusible joining and highly heat-sensitive assemblies.

Sn16.5Bi32.5In51Low-melt alloy
60°CUltra-low melting
2 Wire FormsSolid or flux-cored
Sn16.5Bi32.5In51 Lead-Free Indium Solder Wire
Sn16.5Bi32.5In51 Indium Solder Wire

60°C ultra-low-melting solder wire for highly sensitive assemblies

Sn16.5Bi32.5In51 is designed for applications requiring exceptionally low joining temperature. The alloy can be used for thermal protection devices, fusible connections, laboratory assembly and components that would be damaged by conventional soldering temperatures.

01

60°C Melting Point

Enables ultra-low-temperature joining and fusible applications.

02

Minimal Thermal Exposure

Helps protect extremely heat-sensitive substrates and components.

03

Fusible Joint Capability

Suitable for selected thermal release and safety-related connections.

04

Solid Wire Control

Allows separate flux chemistry and precise alloy placement.

05

Flux-Cored Option

Built-in flux is available for larger wire diameters.

06

Engineering Evaluation

Process reliability should be validated for service temperature and load conditions.

Product Specifications

Core alloy, wire form and packaging information for engineering review and quotation.

Recommended Use

Recommended for thermal protection devices, fusible joints, laboratory assembly and highly temperature-sensitive components.

Product Name
Sn16.5Bi32.5In51 Lead-Free Indium Solder Wire
Alloy Composition
Sn16.5 / Bi32.5 / In51
Alloy Family
Tin-Bismuth-Indium
Melting Point
60°C
Wire Diameter
>0.6 mm solid; >1.0 mm flux-cored
Wire Form
Solid or flux-cored
Flux Option
Flux-cored option available above 1.0 mm
Packaging
100 g or 200 g per spool; 2 kg per box
Typical Applications
Thermal Protection, Fusible Connections, Laboratory Assembly, Heat-Sensitive Components

Typical Applications

Application suitability should be confirmed against substrate finish, flux chemistry, heating profile and reliability requirements.

Application 01Thermal Protection
Application 02Fusible Connections
Application 03Laboratory Assembly
Application 04Heat-Sensitive Components
View the complete lead-free indium solder wire series →

Need Sn16.5Bi32.5In51 solder wire for your process?

Contact Jufeng Solder for alloy confirmation, diameter options, sample evaluation, packaging and quotation support.

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