Red Glue Epibond Adhesive
SMT BGA IC Red Glue Epoxy Adhesive
A heat-curing epoxy adhesive for bonding surface-mounted devices to printed circuit boards before wave soldering, with package options for dispensing and stencil printing.
Heat-curing red glue for SMT component fixation
SMT BGA IC red glue is used to hold surface-mounted components on printed circuit boards before wave soldering. Available package formats support both dispensing equipment and stencil-printing processes.
Heat-Curing Epoxy Adhesive
Designed as a red glue adhesive for electronics assembly processes.
SMT Component Fixation
Supports bonding of surface-mounted devices to printed circuit boards before wave soldering.
Dispensing Machine Formats
20 ml and 30 ml tube options are available for dispensing equipment.
Stencil Printing Formats
200 g and 360 g tube options are available for stencil-printing processes.
Multiple Packaging Choices
Package selection can be matched to the intended application method and production setup.
Process Confirmation Support
Final curing and application conditions should be confirmed by product specification.
Product Specifications
Available product and packaging information for engineering review and quotation.
Recommended Use
Recommended for fixation of SMT, BGA and IC components on printed circuit boards before wave soldering, using compatible dispensing or stencil-printing equipment.
Typical Applications
Application suitability should be confirmed against equipment, substrates, process conditions and production requirements.
Need SMT red glue for your production line?
Contact Jufeng Solder to confirm the package format, application method, equipment compatibility and product specification.
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