Pressure Sinter Silver Paste FC-325LA
FC-325LA Pressure Sinter Silver Paste
A pressure-assisted silver sinter paste for large-area die attachment, compatible with dry or semi-wet bonding and designed to form a dense, high-reliability silver layer.
Large-area silver sintering for power modules
FC-325LA is developed for pressure-assisted large-area bonding. It maintains operational stability during extended printing and forms a uniform, dense silver layer for high-power devices and power-module packages.
Large-Area Sintering
Developed for pressure-assisted bonding across larger die or module areas.
Dry or Semi-Wet Bonding
Compatible with multiple assembly routes according to process design.
High Thermal Conductivity
Specified thermal conductivity exceeds 200 W/m·K.
Dense Silver Layer
Forms a uniform, compact bond layer after the selected pressure-sintering cycle.
Broad Surface Compatibility
Applicable to Ag, Au and Cu surfaces with the required atmosphere.
Six-Month Shelf Life
Supports frozen or refrigerated storage under the specified conditions.
Product Specifications
Technical data for engineering evaluation. Final process settings should be confirmed against the selected substrate, package dimensions and production equipment.
Recommended Use
Recommended for large-area die attachment in SiC and other power modules. A typical reference range is 180–220°C for 5 minutes at 10–15 MPa; final parameters must be adjusted for material dimensions, metallization and atmosphere.
Typical Applications
Application suitability should be confirmed against substrate finish, material dimensions, processing atmosphere and reliability requirements.
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