Pressure Sinter Copper Paste FC-100U
FC-100U Pressure Sinter Copper Paste
A pressure-assisted copper sinter paste for high-reliability power-device die attachment, providing a dense copper layer with high thermal and electrical conductivity.
Dense copper bonding for power semiconductor packaging
FC-100U maintains stable printing performance and forms a uniform, dense copper layer after pressure sintering. It is intended for power-device bonding where heat dissipation and reliable electrical connection are critical.
High Thermal Conductivity
Specified thermal conductivity exceeds 180 W/m·K.
High Electrical Conductivity
Resistivity is specified below 10⁻⁴ Ω·cm.
Dense Sintered Copper Layer
Pressure sintering supports a uniform and compact copper bond layer.
Low CTE
Specified coefficient of thermal expansion is below 20 ppm/K.
Broad Metallization Compatibility
Applicable to Ag, Au and Cu surfaces with the appropriate atmosphere.
Compliance Support
The product is specified as REACH and RoHS compliant.
Product Specifications
Technical data for engineering evaluation. Final process settings should be confirmed against the selected substrate, package dimensions and production equipment.
Recommended Use
Recommended for pressure-assisted die attachment in SiC, GaN and power semiconductor devices. Copper-surface preheating and sintering must be performed under nitrogen; final temperature, pressure and time must be confirmed for the actual die and substrate.
Typical Applications
Application suitability should be confirmed against substrate finish, material dimensions, processing atmosphere and reliability requirements.
Need FC-100U for pressure copper sintering?
Send the die size, metallization, target bond line and available pressure-sintering equipment for process review.
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