Pressure Sinter Copper Paste FC-100U
Pressure Sinter
Copper Paste
FC-100U
FC-100U is a pressure sinter copper paste suitable for pressure sintering processes. It delivers excellent conductivity, stable long-printing operation and dense copper bonding layers for high-reliability power device chip attachment.
Dense copper bonding for power device reliability.
FC-100U pressure sinter copper paste maintains operation stability during long printing processes and forms a uniform, dense copper layer after sintering.
It is designed to provide high reliability and high thermal conductivity for power device chip bonding under pressure sintering conditions.
Pressure Sintering
Designed for pressure sintering processes in power device bonding.
High Conductivity
High thermal and electrical conductivity for reliable chip attachment.
High Shear Strength
Supports strong bonding reliability for power semiconductor applications.
REACH & RoHS
Compliant with REACH and RoHS requirements.
Built for pressure sintering in power electronics.
Suitable for power device chip bonding where thermal conductivity, electrical conductivity and dense copper sintered layers are required.
Key data for engineering review and sample approval.
The following parameters support pressure sintering process selection, storage planning and reliability evaluation.
| Item | Data | Remark |
|---|---|---|
| Viscosity | 5 ± 2 Pa·s | @20rpm viscometer |
| Density | 3.5 g/cm³ | Before sintering |
| Solid Content | >75% | TGA |
| CTE | <20 ppm/K | TMA |
| Thermal Conductivity | >180 W/m·K | Laser flash |
| Resistivity | < 10⁻⁵ Ω·cm | Four-point probe |
| Elastic | 20–30 GPa | ASTM E2546 |
| Applicable Surface | Ag / Au / Cu | — |
| Work Life | 8 hours | @19–25℃ |
| Storage Temperature | -20℃ to 0℃ / 0℃ to 10℃ | Freezing or refrigeration |
| Shelf Life | 3 months | — |
Storage, thawing and mixing guidance.
Keep temperature recovery and mixing conditions clear before opening, printing or bonding. Apparently materials dislike chaos. Reasonable of them.
Storage
Store at -20℃ to 0℃ or 0℃ to 10℃. Avoid direct sunlight and high humidity.
Thawing from Freezer
Thaw at room temperature around 25℃ for 4 hours before opening.
Thawing from Refrigerator
Thaw at room temperature around 25℃ for 2 hours before opening.
Mixing
Recommended vacuum mixing: 800–1200 rpm for 90–180 seconds.
Recommended process conditions.
General recommendations for chip sizes of 10mm × 10mm and smaller. Parameters should be adjusted according to application environment, chip size and materials.
Stencil Printing
Pressure: 2–5kg
Demoulding distance: 2mm
Demoulding speed: 0.5mm/s
Preheating
Temperature: 120℃
Time: 15 minutes
Atmosphere: N₂
Die Bonding
Head temp: 160℃
Orbital temp: 130–150℃
Pressure: 6–8kg
Time: 0.5s
Pressure Sintering
Top / bottom sintering temp: ≥260℃
Pressure: ≥20MPa
Time: ≥10 minutes
Atmosphere: N₂
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