PL-02U Pressureless Sinter Copper Paste
PL-02U Pressureless Sinter Copper Paste
A pressureless copper sinter paste for power semiconductor die attachment and thermal management, developed to provide conductive copper bonding without external sintering pressure.
Pressureless copper bonding for power semiconductor packages
PL-02U provides a copper-based pressureless bonding route for high-power devices. The material is intended for conductive die attachment and thermal management where nitrogen-controlled processing and a suitable heating profile are available.
Pressureless Copper Sintering
Designed to form a copper bond layer without applied sintering pressure.
High Thermal Conductivity
Specified thermal conductivity exceeds 110 W/m·K.
Low Electrical Resistivity
Specified resistivity is below 5×10⁻⁵ Ω·cm.
Strong Bonding
Reference shear strength is at least 30 MPa for the stated test condition.
Multiple Metallizations
Applicable to Ag, Au and Cu surfaces with process confirmation.
Nitrogen Processing
Nitrogen protection is required for the specified copper-sintering route.
Product Specifications
Technical data for engineering evaluation. Final process settings should be confirmed against the selected substrate, package dimensions and production equipment.
Recommended Use
Recommended for pressureless copper die attachment in power semiconductors and high-thermal-load modules. Use nitrogen and confirm the complete heating profile, bond area and substrate finish before production.
Typical Applications
Application suitability should be confirmed against substrate finish, material dimensions, processing atmosphere and reliability requirements.
Need PL-02U pressureless copper sinter paste?
Send the metallization, die size, bond area and nitrogen-oven capability for material and profile confirmation.
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