Non Pressure Sinter Silver Paste PL-400CP
PL-400CP
Non Pressure Sinter Silver Paste
PL-400CP is a silver sintering paste suitable for non-pressure sintering on copper surfaces. It delivers stable dispensing performance, excellent conductivity and efficient heat dissipation for high-power device bonding.
Optimized for copper surface sintering.
PL-400CP is designed for non-pressure sintering processes on copper surfaces. After sintering, the silver layer is uniform and can quickly dissipate heat for high-power devices.
Compared with traditional solder, it offers much higher thermal conductivity and is suitable for power semiconductor and high-reliability bonding applications where Cu surface compatibility is required.
For Copper Surface
Designed for non-pressure silver sintering on Cu surfaces.
High Conductivity
High thermal and electrical conductivity for reliable device bonding.
Stable Dispensing
Stable dispensing performance for controlled deposition and process consistency.
Excellent RBO Control
Supports improved reliability control in sintering applications.
Designed for high-power and high-reliability device bonding.
Suitable for copper surface sintering applications where thermal conductivity, electrical conductivity and stable sintered silver layers are required.
Key data for engineering review and sample approval.
The following parameters support copper surface sintering process selection, storage planning and reliability evaluation.
| Item | Data | Remark |
|---|---|---|
| Viscosity | 9 ± 2 Pa.s, 25℃ | @100s⁻¹ tested by rheometer |
| Density | 4.8 g/cm³ | Before sintering |
| Solid Content | >80% | TGA |
| CTE | 14.37 ppm | TMA |
| Thermal Conductivity | >200 W/m·K | Laser Flash |
| Resistivity | <6 μΩ·cm | — |
| Applicable Surface | Cu | — |
| Storage Temperature | -10℃ to 0℃ | Cold storage |
| Melting Point | 961℃ | DSC |
| Work Life | 8 hours | @19–25℃ |
| Shelf Life | 6 months | — |
Recommended handling flow.
Keep storage, thawing, dispensing and sintering conditions clear for engineering teams before sample testing.
Cold Storage
Store at -10℃ to 0℃ and avoid direct sunlight or high-humidity environments.
Thawing
Thaw at room temperature around 25℃ for 2–4 hours and wipe water from the container before use.
Dispensing
Dispense the silver paste into an “X” or “✳” shape according to bonding design.
Die Attachment
Fit the chip evenly onto the silver paste layer before sintering.
Recommended sintering parameters.
Recommended peak temperature range is 200–260℃, with holding time adjusted according to device structure, substrate and reliability requirements.
PL-400CP Reflow Profile
RT–130℃: 45 minutes device heating time
130℃: hold for 30 minutes
130℃ to peak temperature: 20 minutes device heating time
Peak temperature: 200–260℃, hold for 90–120 minutes
Cooling: cool to room temperature
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