Non Pressure Sinter Silver Paste PL-400CP
PL-400CP Pressureless Silver Sinter Paste
A pressureless silver sinter paste optimized for copper surfaces, with stable dispensing, high thermal conductivity and a uniform silver layer after sintering.
Pressureless silver sintering directly on copper surfaces
PL-400CP is designed for non-pressure sintering on copper. It supports stable dispensing and forms a uniform silver layer that helps high-power devices transfer heat more efficiently than conventional solder joints.
Copper-Surface Formulation
Developed for pressureless sintering on copper metallization.
High Thermal Conductivity
Specified thermal conductivity exceeds 200 W/m·K.
Low Electrical Resistivity
Specified resistivity is below 6 μΩ·cm.
Stable Dispensing
Rheology supports controlled dispensing during die-attach processing.
Uniform Sintered Layer
Forms a consistent silver bond layer under the selected heating profile.
Eight-Hour Work Life
Specified work life is eight hours at 19–25°C.
Product Specifications
Technical data for engineering evaluation. Final process settings should be confirmed against the selected substrate, package dimensions and production equipment.
Recommended Use
Recommended for pressureless die attachment on copper surfaces in high-power electronic devices. Dispense the paste in a suitable pattern, place the die evenly, and confirm the heating profile for the actual package and bond area.
Typical Applications
Application suitability should be confirmed against substrate finish, material dimensions, processing atmosphere and reliability requirements.
Need PL-400CP for copper-surface die attach?
Provide the copper finish, die dimensions, bond area and available oven profile for pressureless sintering review.
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