JL-LM02 Conductive Silver Paste
JL-LM02 Low-Modulus Conductive Silver Paste
A low-modulus conductive silver paste for semiconductor packaging, compatible with dispensing and screen printing and designed for conductive bonding with good substrate adhesion.
Low-modulus silver paste for semiconductor packaging
JL-LM02 combines high thermal and electrical conductivity with a comparatively low modulus. It is suitable for dispensing and screen printing where a conductive bond layer and accommodation of package stress are required.
High Thermal Conductivity
Specified thermal conductivity exceeds 100 W/m·K.
High Electrical Conductivity
Specified resistivity is below 10⁻⁴ Ω·cm.
Low Modulus
Specified modulus is below 6 GPa at 25°C.
Dispensing Compatibility
Suitable for controlled die-attach dispensing patterns.
Screen Printing Compatibility
Supports printed conductive adhesive applications.
Good Substrate Adhesion
Forms a bonded silver layer on ceramic, polymer and metal surfaces after processing.
Product Specifications
Technical data for engineering evaluation. Final process settings should be confirmed against the selected substrate, package dimensions and production equipment.
Recommended Use
Recommended for semiconductor packaging, conductive die attachment and printed conductive bonding. Apply by dispensing or screen printing, then use a confirmed baking profile matched to the substrate, bond area and equipment.
Typical Applications
Application suitability should be confirmed against substrate finish, material dimensions, processing atmosphere and reliability requirements.
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