JL-LM02 Conductive Silver Paste
JL-LM02
Conductive Silver Paste
JL-LM02 is a low-modulus conductive silver paste for semiconductor packaging. It offers high thermal conductivity, high electrical conductivity, excellent operability and reliable adhesion after sintering.
Low-modulus silver paste for semiconductor packaging.
JL-LM02 is suitable for dispensing and screen printing applications in semiconductor packaging.
After sintering, the material provides good adhesion to substrate while maintaining high thermal and electrical conductivity. A product page with actual parameters, a rare mercy in the wasteland of vague adjectives.
High Thermal Conductivity
Thermal conductivity above 100 W/m·K supports heat dissipation in packaging applications.
High Conductivity
Resistivity below 10⁻⁴ Ω·cm provides stable conductive performance.
Low Modulus
Modulus below 6 GPa at 25℃ helps support packaging reliability.
Excellent Operability
Suitable for dispensing and screen printing processes.
Designed for conductive bonding and surface mount processes.
Suitable for semiconductor packaging where low modulus, conductivity and stable silver paste processing are required.
Key data for engineering review and sample approval.
The following parameters support conductive silver paste evaluation, process selection and reliability testing.
| Item | Data | Test Method / Remark |
|---|---|---|
| Viscosity | 6 ± 2 Pa·s | 25℃, @20rpm; tested by viscometer |
| Density | 4.8 g/cm³ | Before sintering |
| Solid Content | >80% | TGA |
| Thermal Conductivity | >100 W/m·K | Laser flash deposition |
| Resistivity | <10⁻⁴ Ω·cm | — |
| Glass Transition Temperature | 70℃ | — |
| Modulus | <6 GPa | 25℃ |
| Applicable Surface | Ceramic / Polymer / Metal | — |
| Storage Temperature | -10℃ to 10℃ | Avoid sunlight or high humidity |
| Work Life | 8 hours | @25℃ |
| Shelf Life | 6 months | — |
Storage, recovery and process guidance.
Recommended handling for stable dispensing, screen printing and sintering performance.
Storage
Store at -10℃ to 10℃ and avoid direct sunlight or high-humidity environments.
Thermal Recovery
After removal from cold storage, place at room temperature around 25℃ for 4 hours.
Before Use
Thaw and wipe off water outside the container before use.
Process
Apply uniformly in an “X” or “✳” shape, place the chip flat, then sinter according to recommended parameters.
Recommended baking curve.
The recommended sintering baking curve is adjustable according to actual usage and device requirements.
JL-LM02 Baking Curve
Ramp from room temperature to 130℃
Hold around 130℃ during the first stage
Ramp to 200℃ for main sintering stage
Hold at 200℃ according to process requirement
Cooling: cool down to room temperature
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