JL-CS01-FE Flexible Conductive Copper Paste
JL-CS01-FE
Flexible Conductive Copper Paste
JL-CS01-FE is a one-component, low-temperature fast-curing conductive copper paste designed for flexible electronics. It combines excellent electrical conductivity with outstanding flexibility, helping maintain stable performance across various assembly processes.
Built for flexible conductive circuits.
JL-CS01-FE is formulated for flexible electronic applications that require stable conductivity, bend resistance and fast low-temperature curing.
The paste is suitable for printed conductive patterns on PET, PI, ceramic and metal surfaces, supporting flexible pressure touch devices, sensors and high-precision electronic manufacturing processes.
Low-Temperature Fast Curing
Cures at 160℃ for 2 minutes in air or nitrogen atmosphere using an oven.
High Conductivity
Resistivity reaches 1.5×10-4 Ω·cm, tested by four-point probe.
Good Bending Resistance
Designed for flexible electronics where conductive lines must remain stable during bending.
Easy Processing
Supports stencil or screen printing with 100–300 mesh screens.
Designed for flexible electronics and printed conductive patterns.
Suitable for flexible electronic products, flexible pressure touch devices, printed circuits, sensors and other high-precision electronic manufacturing processes.
Key data for flexible electronics process review.
The following parameters are organized from the JL-CS01-FE technical data sheet for engineering evaluation, printing process setup and sample approval.
| Item | Data | Remark |
|---|---|---|
| Appearance | Brown-gray paste | Visual inspection |
| Viscosity | 25±5 Pa.s | Viscometer @20rpm |
| Solid Content | >80% | TGA |
| Curing Condition | 160℃ / 2 min | Air or nitrogen atmosphere; oven |
| Resistivity | 1.5×10-4Ω·cm | Four-point probe |
| Applicable Interface | PET / PI / Ceramic / Metal | — |
| Process | Printing | Stencil or screen printing |
| Storage Temperature | -10℃ to 10℃ | Avoid high-humidity storage |
| Shelf Life | 3 months | — |
Recommended handling flow.
Control storage, thawing, printing and curing conditions before sample testing. Tiny detail, large consequences, because apparently materials enjoy punishing sloppy process windows. 🧪
Cold Storage
Store at -10℃ to 10℃ after receipt and avoid high-humidity environments.
Thawing
Place at room temperature around 25℃ for 4 hours to thaw fully, then wipe water from the container.
Mixing
Centrifugal stirring for 3–5 minutes before use is recommended for better processing performance.
Printing
Use stencil or screen printing. Recommended screen mesh: 100–300 mesh. Apply evenly with a scraper.
Recommended printing and curing process.
The TDS recommends printing the paste onto the substrate, then curing in an oven from room temperature to 160℃ and holding for 2 minutes. Curing time may be extended according to the printed pattern size.
Step 1: Printing
Use stencil or screen printing. Recommended screen mesh is 100–300 mesh. Scrape evenly to print the conductive copper paste onto the substrate.
Step 2: Curing
Place the sample in an oven. Heat from room temperature to 160℃ and hold for 2 minutes. Extend time properly depending on printed pattern size.
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