JL-CS01-FE Flexible Conductive Copper Paste
JL-CS01-FE Flexible Conductive Copper Paste
A one-component, low-temperature fast-curing conductive copper paste developed for flexible electronics, printed conductive patterns and bendable electronic structures.
Flexible copper paste for printed conductive patterns
JL-CS01-FE combines electrical conductivity with flexibility and rapid oven curing. It is designed for printed conductive structures that must retain stable performance on flexible or precision electronic substrates.
Low-Temperature Fast Curing
Cures at 160°C for 2 minutes in an oven under air or nitrogen.
Flexible Conductive Layer
Designed to support bendable conductive patterns and flexible electronic structures.
Stable Conductivity
Provides a typical volume resistivity of 1.5×10⁻⁴ Ω·cm after curing.
Broad Substrate Compatibility
Applicable to PET, PI, ceramic and metal surfaces.
Screen & Stencil Printing
Supports printing with a recommended screen range of 100–300 mesh.
Controlled Cold Storage
Three-month shelf life when stored from -10°C to 10°C under suitable conditions.
Product Specifications
Technical data for engineering evaluation. Final process settings should be confirmed against the selected substrate, package dimensions and production equipment.
Recommended Use
Recommended for screen or stencil printing of conductive patterns on flexible substrates. Allow the material to recover at room temperature before use and confirm curing time against printed area and substrate heat resistance.
Typical Applications
Application suitability should be confirmed against substrate finish, material dimensions, processing atmosphere and reliability requirements.
Need JL-CS01-FE for a flexible electronics project?
Send your substrate, printed pattern, curing limit and conductivity target for sample and technical review.
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