JL-CS01 Conductive Copper Paste
JL-CS01 Solderable Conductive Copper Paste
A low-temperature curable conductive copper paste with reliable solderability for electronic packaging, printed circuits, repair, solar interconnections and RF assembly.
Printable copper paste with a solderable conductive surface
JL-CS01 is engineered for printed conductive structures that must support subsequent soldering. It provides stable conductivity and bonding compatibility with both tin-lead and lead-free solder systems on suitable metal, ceramic and plastic substrates.
Low-Temperature Curing
Cures at 150°C for 30–60 minutes, reducing thermal stress on suitable substrates.
Solderable Surface
Compatible with both tin-lead and lead-free solder wire or solder paste.
Stable Conductivity
Specified resistivity is 3.9–9.6×10⁻⁵ Ω·cm.
Screen & Stencil Printing
Supports polyester screens from 150–400 mesh and 20–50 μm thickness.
Broad Substrate Range
Applicable to metal, ceramic and selected plastic surfaces, including PET and PI.
Long-Term Solderability
Designed to retain soldering performance during the specified storage period.
Product Specifications
Technical data for engineering evaluation. Final process settings should be confirmed against the selected substrate, package dimensions and production equipment.
Recommended Use
Recommended for printed conductive and solderable patterns used in packaging, repair, solar and RF applications. Cure in nitrogen or a hot-air circulation oven and confirm the final time according to printed thickness and substrate.
Typical Applications
Application suitability should be confirmed against substrate finish, material dimensions, processing atmosphere and reliability requirements.
Need JL-CS01 for a solderable printed conductor?
Share the substrate, print thickness, curing limit and soldering process for sample and technical confirmation.
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