JL-CS01 Conductive Copper Paste
JL-CS01
Conductive Copper Paste
JL-CS01 is a low-temperature curable conductive copper paste engineered for high-performance electronic applications. It delivers excellent electrical conductivity, soldering reliability and stable performance across a wide range of assembly processes.
Low-temperature curable paste for reliable conductive bonding.
JL-CS01 is designed for high-performance electronic manufacturing processes where stable conductivity, solder compatibility and low-temperature processing are required.
It supports screen printing and stencil printing, making it suitable for electronic packaging, PCB repair, solar cell interconnections, RF components and flexible printed circuits.
Low-Temperature Curing
Minimizes thermal stress on components during assembly.
High Conductivity
Provides efficient and stable current flow for electronic applications.
Solder Compatibility
Excellent bonding with both Sn/Pb and lead-free solders.
Long-Term Stability
Retains solderability even after extended storage.
Built for high-precision electronic manufacturing.
Suitable for conductive bonding, solderable surfaces and precision assembly processes across packaging, repair, RF and flexible electronics.
Key data for engineering review and sample approval.
The following technical parameters help engineers and purchasing teams evaluate processing conditions, conductivity, substrate compatibility and storage requirements.
| Item | Data | Remark |
|---|---|---|
| Appearance | Brown high-viscosity paste | Visual |
| Viscosity | 5–30 Pa.s | @ 20rpm, tested by viscometer |
| Solid Content | >80% | TGA |
| Thermal Conductivity | 60–80W | High thermal conductivity |
| Curing Conditions | 150℃ / 30–60min | N2 atmosphere or hot air circulation oven |
| Resistivity | 3.9–9.6×10^-5 Ω·cm | Four-point probe |
| Applicable Surface | Metal / ceramic / plastic | PET or PI films for plastics; copper or silver preferred for metals |
| Solderability | Good | Both solder wire and solder paste are acceptable |
| Construction Technology | Screen printing / stencil printing | Polyester screen, 150–400 mesh, 20–50 μm thickness |
| Storage Temperature | Refrigeration, 0–10℃ | Store refrigerated |
| Shelf Life | 3 months | Store below 10℃ |
Designed for practical assembly and rework processes.
Curing
150℃ for 30–60 minutes under N2 atmosphere or hot air circulation oven.
Printing
Screen printing or stencil printing for controlled deposition.
Surface
Compatible with metal, ceramic and plastic substrates.
Storage
Refrigerated storage at 0–10℃. Shelf life is 3 months below 10℃.
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