JF1206 Solder Preform

JF1206 solder preform is supplied for precision electronic assembly, solder volume control, automated placement, and customized soldering processes. Standard dimensions are available, with OEM customization supported for alloy, shape, flux coating, and packaging.

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JF1206 Solder Preform

The largest standard model in this solder preform series, providing fixed geometry and solder volume for controlled assembly and OEM placement processes.

JF1206Standard model

3.56 × 1.52 × 0.77 mmStandard dimensions

4.170 mm³Fixed solder volume

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JF1206 Standard Solder Preform

Large standard solder preform for higher fixed solder volume

JF1206 is the largest standard chip-style model shown in this series. Its 3.56 × 1.52 × 0.77 mm dimensions provide a listed solder volume of 4.170 mm³, with both 7-inch and 13-inch reel quantities available on the source page.

Largest Standard Model

3.56 × 1.52 × 0.77 mm dimensions within the listed product range.

Higher Fixed Volume

Defined solder volume of 4.170 mm³.

7-Inch Reel Quantity

The listed 7-inch reel quantity is 4,000 pieces.

13-Inch Reel Quantity

The listed 13-inch reel quantity is 15,000 pieces.

Plastic Carrier Format

Plastic carrier material is listed for JF1206.

OEM Configuration Support

Alloy, shape, flux coating and packaging can be customized by requirement.

Product Specifications

Standard dimensions, volume and carrier tape information for engineering review and purchasing reference.

Recommended Use

Recommended for precision assembly processes requiring a larger standard solder preform and a fixed solder volume of 4.170 mm³.

Product Name

JF1206 Solder Preform

Model

JF1206

Standard Dimensions

3.56 × 1.52 × 0.77 mm

Solder Volume

4.170 mm³

Product Form

Chip-style solder preform

7-Inch Reel Quantity

4,000 pieces

13-Inch Reel Quantity

15,000 pieces

Carrier Material

Plastic

Flux Option

Pure alloy or flux coating

OEM Support

Alloy, size, shape and package

Typical Applications

Final suitability should be confirmed against joint geometry, alloy requirements, placement equipment and the selected soldering process.

Application 01Higher-Volume Solder Control

Application 02Automated Placement

Application 03Precision Electronic Assembly

Application 04Customized OEM Soldering

Need JF1206 large solder preforms?

Contact Jufeng Solder to confirm alloy, flux option, reel packaging and customized OEM requirements.

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