JF0201 Solder Preform

JF0201 solder preform is supplied for precision electronic assembly, solder volume control, automated placement, and customized soldering processes. Standard dimensions are available, with OEM customization supported for alloy, shape, flux coating, and packaging.

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JF0201 Solder Preform

A compact standard solder preform with fixed chip-style geometry for precise solder volume control and automated placement requirements.

JF0201Standard model

0.60 × 0.30 × 0.30 mmStandard dimensions

0.054 mm³Fixed solder volume

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JF0201 Standard Solder Preform

Compact solder preform for controlled micro-volume soldering

JF0201 is the smallest standard model in this series. Its fixed 0.60 × 0.30 × 0.30 mm geometry provides a defined solder volume of 0.054 mm³ for precision assembly and OEM processes requiring compact preform dimensions.

Compact Standard Size

0.60 × 0.30 × 0.30 mm chip-style geometry.

Defined Solder Volume

Fixed volume of 0.054 mm³ for repeatable solder input.

High 7-Inch Reel Quantity

The listed 7-inch reel quantity is 20,000 pieces.

Paper Carrier Option

The source page lists paper as the carrier material for JF0201.

Flux Option Support

Pure alloy or flux-coated supply can be discussed according to process needs.

OEM Customization

Alloy, size, shape and packaging can be reviewed for custom requirements.

Product Specifications

Standard dimensions, volume and carrier tape information for engineering review and purchasing reference.

Recommended Use

Recommended for precision electronic assembly, controlled solder-volume applications and automated placement where the JF0201 standard dimensions match the component and joint design.

Product Name

JF0201 Solder Preform

Model

JF0201

Standard Dimensions

0.60 × 0.30 × 0.30 mm

Solder Volume

0.054 mm³

Product Form

Chip-style solder preform

7-Inch Reel Quantity

20,000 pieces

13-Inch Reel Quantity

Not listed for this model

Carrier Material

Paper

Flux Option

Pure alloy or flux coating

OEM Support

Alloy, size, shape and package

Typical Applications

Final suitability should be confirmed against joint geometry, alloy requirements, placement equipment and the selected soldering process.

Application 01Precision Electronic Assembly

Application 02Micro-Volume Solder Control

Application 03Tape & Reel Placement

Application 04Customized OEM Soldering

Need JF0201 solder preforms for your assembly?

Contact Jufeng Solder to confirm alloy, flux coating, reel quantity, carrier format and OEM requirements.

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