In99.9 Lead-Free Indium Solder Wire

In99.9
In99.9 lead-free indium solder wire is a high-purity indium solder wire for soft, low-temperature bonding. It is suitable for electronics assembly, low-temperature soldering, rework, bonding, and customized soldering processes where alloy composition, wire diameter, and flux form need to be matched carefully.
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In99.9 Lead-Free Indium Solder Wire

High-purity indium solder wire for soft, low-temperature bonding, thermal interfaces, sealing and precision electronic assembly.

In99.9High-purity indium
156.7°CMelting point
Soft & DuctileCompliant joints
In99.9 Lead-Free Indium Solder Wire
In99.9 Indium Solder Wire

High-purity indium wire for soft and compliant bonding

In99.9 solder wire provides the low melting point, softness and ductility associated with high-purity indium. It is well suited to joints that must accommodate thermal expansion mismatch, maintain compliance or provide thermal and electrical contact at relatively low process temperatures.

01

High-Purity Indium

In99.9 composition supports consistent material behavior for specialty bonding.

02

Low Melting Point

Melts at approximately 156.7°C for lower-temperature joining processes.

03

Soft Joint Behavior

Ductile indium can help accommodate differential thermal expansion.

04

Thermal Interface Use

Suitable for selected thermal contact and interface applications.

05

Sealing Capability

Indium is used in soft-metal seals and precision sealing assemblies.

06

Solid Wire Control

External flux and process chemistry can be selected for the target substrates.

Product Specifications

Core alloy, wire form and packaging information for engineering review and quotation.

Recommended Use

Recommended for die attach, thermal interfaces, hermetic or vacuum sealing, cryogenic assemblies and precision electronics.

Product Name
In99.9 Lead-Free Indium Solder Wire
Alloy Composition
In99.9
Alloy Family
High-Purity Indium
Melting Point
156.7°C
Wire Diameter
>1.0 mm
Wire Form
Solid wire
Flux Option
No built-in flux core
Packaging
100 g or 200 g per spool; 2 kg per box
Typical Applications
Thermal Interfaces, Die Attach, Hermetic Sealing, Cryogenic Assemblies

Typical Applications

Application suitability should be confirmed against substrate finish, flux chemistry, heating profile and reliability requirements.

Application 01Thermal Interfaces
Application 02Die Attach
Application 03Hermetic Sealing
Application 04Cryogenic Assemblies
View the complete lead-free indium solder wire series →

Need In99.9 solder wire for your process?

Contact Jufeng Solder for alloy confirmation, diameter options, sample evaluation, packaging and quotation support.

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