In97Ag3 Lead-Free Indium Solder Wire

In97Ag3

In97Ag3 lead-free indium solder wire is a indium-silver solder wire for low-temperature bonding and improved joint performance. It is suitable for electronics assembly, low-temperature soldering, rework, bonding, and customized soldering processes where alloy composition, wire diameter, and flux form need to be matched carefully.

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In97Ag3 Lead-Free Indium Solder Wire

An indium-silver lead-free solder wire with a 143°C melting point for soft low-temperature bonding and improved joint performance.

In97Ag3Indium-silver alloy

143°CMelting point

Lead-FreeLow-temperature joining

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In97Ag3 Indium Solder Wire

Indium-silver solder wire for low-temperature precision bonding

In97Ag3 combines a high indium content with 3% silver. The alloy melts at approximately 143°C and is selected for low-temperature electronic joining where soft joint behavior, controlled heat input and improved mechanical response are desired.

143°C Melting Point

Supports low-temperature bonding for heat-sensitive assemblies.

High Indium Content

Provides soft and compliant behavior for specialty joints.

Silver Addition

Silver modifies joint performance compared with pure indium wire.

Thermal Mismatch Accommodation

Suitable for selected assemblies using dissimilar materials.

Precision Solid Wire

Allows controlled alloy feed and separate flux selection.

Lead-Free Specialty Alloy

Useful for advanced electronics, optical and sensor applications.

Product Specifications

Core alloy, wire form and packaging information for engineering review and quotation.

Recommended Use

Recommended for die attach, optical modules, sensors, thermal interfaces and precision low-temperature bonding.

Product Name

In97Ag3 Lead-Free Indium Solder Wire

Alloy Composition

In97 / Ag3

Alloy Family

Indium-Silver

Melting Point

143°C

Wire Diameter

>1.0 mm

Wire Form

Solid wire

Flux Option

No built-in flux core

Packaging

100 g or 200 g per spool; 2 kg per box

Typical Applications

Die Attach, Optical Modules, Sensors, Thermal Interfaces

Typical Applications

Application suitability should be confirmed against substrate finish, flux chemistry, heating profile and reliability requirements.

Application 01Die Attach

Application 02Optical Modules

Application 03Sensors

Application 04Thermal Interfaces

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