CP-500FE Flexible Conductive Carbon Paste

CP-500FE is a one-component, low-temperature fast-curing flexible conductive carbon paste designed for flexible electronics. It is suitable for PET and PI flexible substrates, offering good conductivity, excellent flexibility, strong adhesion and smooth screen-printing performance.

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CP-500FE Flexible Conductive Carbon Paste

A one-component flexible conductive carbon paste for PET and PI substrates, combining low-temperature curing, screen-printing performance, adhesion and bend resistance.

120°C / 15 minLow-temperature oven curing

1×10⁻² Ω·cmVolume resistivity

5B AdhesionASTM D3359 cross-cut

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CP-500FE Flexible Conductive Carbon Paste

Screen-printable carbon paste for flexible electronics

CP-500FE is formulated for flexible circuits and printed electronic structures on PET and PI. Its black conductive layer supports stable screen printing, strong adhesion and repeated bending in suitable applications.

Low-Temperature Curing

Cures at 120°C for 15 minutes in air or nitrogen.

Flexible Performance

Designed for bendable circuits, sensors and wearable electronic structures.

Screen Printing Quality

Supports smooth printed surfaces on PI and PET with suitable process control.

Strong Adhesion

Achieves a typical 5B adhesion rating according to ASTM D3359.

Room-Temperature Storage

Can be stored at room temperature under the recommended conditions.

Long Shelf Life

Provides a specified shelf life of 12 months when correctly stored.

Product Specifications

Technical data for engineering evaluation. Final process settings should be confirmed against the selected substrate, package dimensions and production equipment.

Recommended Use

Recommended for conductive carbon patterns on PET and PI using screen or stencil printing. Use a 100–300 mesh screen as a starting point and adjust curing time according to printed pattern size.

Product Name

CP-500FE Flexible Conductive Carbon Paste

Material Type

One-component flexible conductive carbon paste

Appearance

Black

Viscosity

14±2 Pa·s, viscometer @10 rpm

Density

1.3 g/cm³

Solid Content

35%, TGA

Curing Conditions

120°C for 15 minutes; air or nitrogen

Volume Resistivity

1×10⁻² Ω·cm

Applicable Surfaces

PET / PI

Adhesion

5B, ASTM D3359

Application Process

Printing; recommended screen 100–300 mesh

Storage / Shelf Life

Room-temperature storage / 12 months

Typical Applications

Application suitability should be confirmed against substrate finish, material dimensions, processing atmosphere and reliability requirements.

Application 01Flexible Circuits & Touch Panels

Application 02Flexible Sensors & Wearables

Application 03Membrane Switches & RFID

Application 04Flexible Heaters

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