Conductive Epoxy Adhesive JL-LG02
JL-LG02
Conductive Epoxy Adhesive
JL-LG02 is a single-component conductive silver epoxy for semiconductor packaging. It is designed for low outgassing, stable conductivity and reliable die attachment, with compatibility for dispensing and screen printing processes.
Built for semiconductor packaging applications.
JL-LG02 provides excellent electrical conductivity and extremely low outgassing for semiconductor packaging applications.
After curing, it offers good substrate adhesion and supports both dispensing and screen printing processes for die attachment and precision bonding.
Low Outgassing
Designed for semiconductor-sensitive packaging environments.
High Conductivity
Stable electrical conductivity for reliable device connection.
Low Chlorine
Low chlorine content helps support reliability-sensitive applications.
Process Compatibility
Compatible with dispensing and screen printing processes.
Designed for semiconductor packaging and die attachment.
Suitable for conductive bonding applications where low outgassing, adhesion and electrical conductivity are required.
Key data for engineering review and sample approval.
The following parameters support material evaluation, process selection and RFQ communication.
| Item | Data | Remark |
|---|---|---|
| Color before cure | Silver | Visual |
| Viscosity | 6 ± 2 Pa.s | 25℃, @20rpm by Viscometer |
| Thermal Conductivity | >8 W/m·K | Laser Flash Method (LFM) |
| Resistivity | <10⁻⁴ Ω·cm | Four-point probe |
| Ion Content | Cl¯<70ppm | — |
| Thixotropic Index | 2.2 | @5.0rpm / @20rpm |
| Weight Loss @200℃ | 0.073% | TGA |
| Weight Loss @250℃ | 0.23% | TGA |
| Weight Loss @300℃ | 1.39% | TGA |
| Glass Transition Temp. | 89℃ | TMA |
| CTE below Tg | 30 ppm/℃ | TMA |
| CTE above Tg | 100 ppm/℃ | TMA |
| Die Shear @23℃ | >40 MPa | Die size 3 × 3mm |
| Applicable Surface | Ceramic / Polymer / Metal | — |
| Storage Temperature | 0–10℃ | Refrigeration |
| Shelf Life | 6 months | Store below 10℃ |
Recommended handling flow.
Keep storage, temperature recovery, dispensing and curing conditions clear for engineering teams before sample testing.
Storage
Store at 0–10℃ and avoid direct sunlight or high-humidity environments.
Temperature Recovery
Before use, place at room temperature around 25℃ for 1–2 hours.
Dispense or Print
Apply the silver epoxy uniformly into the designed shape or bonding area.
Thermal Cure
Raise from room temperature to 150℃ and hold for 60 minutes.
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