Conductive Epoxy Adhesive JL-LG02
Conductive Epoxy Adhesive JL-LG02
A one-component silver-filled conductive epoxy adhesive for semiconductor die attach, combining low outgassing, low chloride content and strong substrate adhesion.
Conductive adhesive for reliable semiconductor die attachment
JL-LG02 provides conductive bonding for packaging applications where adhesion, ionic cleanliness and controlled outgassing are important. It can be applied by dispensing or screen printing and cured at a moderate temperature.
High Die-Attach Strength
Typical die shear exceeds 40 MPa for a 3×3 mm die at 23°C.
Low Ionic Contamination
Specified chloride ion content is below 70 ppm.
Controlled Outgassing
Low weight loss supports sensitive electronic packaging evaluation.
Conductive Bond Line
Provides resistivity below 10⁻⁴ Ω·cm and thermal conductivity above 8 W/m·K.
Process Flexibility
Compatible with dispensing and screen-printing application methods.
Refrigerated Stability
Specified shelf life is six months when stored at 0–10°C.
Product Specifications
Technical data for engineering evaluation. Final process settings should be confirmed against the selected substrate, package dimensions and production equipment.
Recommended Use
Recommended as a conductive die-attach adhesive for semiconductor packages and compact electronic assemblies. Apply evenly, place the die flat, and cure by ramping to 150°C and holding for 60 minutes.
Typical Applications
Application suitability should be confirmed against substrate finish, material dimensions, processing atmosphere and reliability requirements.
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