SAC305 (Sn96.5Ag3.0Cu0.5) Solder Ball / BGA Reballing

SAC305 lead-free solder balls are widely used for BGA reballing, semiconductor packaging, and electronic assembly requiring stable lead-free soldering performance. Available in multiple diameters and export packing options for repair, reballing, packaging, and precision assembly needs.

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SAC305 (Sn96.5Ag3.0Cu0.5) Solder Ball / BGA Reballing

A lead-free solder sphere based on the SAC305 alloy system for BGA reballing, semiconductor packaging and related electronics assembly work.

SAC305Lead-free alloy system

BGA ReballingSolder ball application

Lead-FreeFor alloy selection review

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SAC305 (Sn96.5Ag3.0Cu0.5) Solder Ball

Lead-free SAC305 solder sphere for BGA reballing and packaging

SAC305 solder ball uses the common Sn96.5Ag3.0Cu0.5 lead-free alloy composition. It is used for BGA reballing and semiconductor packaging projects where a lead-free solder sphere is required and the final diameter and process conditions will be selected according to the product specification.

SAC305 Alloy System

Based on the Sn96.5Ag3.0Cu0.5 lead-free solder composition.

BGA Reballing Focus

Suitable for BGA reballing and related solder sphere assembly work.

Lead-Free Option

Intended for applications that require a lead-free solder ball selection.

Solder Sphere Format

Supplied as a solder ball format for controlled sphere-based processes.

Selection by Specification

Diameter, packaging and process details should be confirmed by product specification.

Engineering Review Support

Use the alloy and application information for quotation and engineering evaluation.

Product Specifications

Product and supply information for engineering review, purchasing reference and quotation discussion.

Recommended Use

Recommended for BGA reballing, semiconductor packaging, repair and rework, and precision electronics assembly where a lead-free SAC305 solder sphere is required.

Product Name

SAC305 (Sn96.5Ag3.0Cu0.5) Solder Ball / BGA Reballing

Alloy Composition

Sn96.5 / Ag3.0 / Cu0.5

Alloy Family

Tin-Silver-Copper

Compliance Type

Lead-free

Product Form

Solder Ball / Solder Sphere

Primary Use

BGA reballing and semiconductor packaging

Diameter Range

Confirm by product specification

Packaging

Available upon request

Process Note

Use with suitable flux and selected process conditions

Final Specification

Subject to selected diameter and packaging

Typical Applications

Application suitability should be confirmed against your alloy requirement, solder sphere size, substrate condition and process profile.

Application 01BGA Reballing

Application 02Semiconductor Packaging

Application 03PCB Repair & Rework

Application 04Precision Electronics Assembly

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