SMT BGA IC Red Glue & PUR Hot Melt Glue
SMT BGA IC Red Glue & PUR Hot Melt Glue
Adhesive products for SMT, BGA and IC assembly, surface-mounted device bonding, stencil printing, dispensing machine processes, and mobile electronics sealing. Available options include red glue epoxy adhesive and PUR hot melt glue sealant.
Adhesive materials for SMT component bonding and mobile electronics sealing.
SMT BGA IC red glue is a heat-curing epoxy adhesive designed for bonding surface-mounted devices to printed circuit boards before wave soldering. PUR hot melt glue sealant is used for mobile electronics such as mobile phones, smart phones, tablets, and wearables.
SMT Red Glue
Heat-curing epoxy adhesive for bonding surface-mounted devices to printed circuit boards.
Dispensing Machine Use
20ml and 30ml tube options are available for dispensing machine processes.
Stencil Printing Option
200g/tube and 360g/tube options are available for stencil printing.
PUR Sealant
JF-H832 is a PUR hot melt glue sealant for mobile electronics and wearable devices.
Available adhesive products
Each adhesive product or packaging option is displayed as a separate product-style item. The image URL is temporarily reused and can be replaced later with actual tube, cartridge, dispensing, or application photos.
Quick technical matrix
For quick comparison, the table below summarizes the adhesive type, description, process and packaging information.
| Adhesive | Description | Process / Use | Packaging |
|---|---|---|---|
| SMD SMT BGA IC Red Glue Epibond Adhesives | A heat-curing epoxy adhesive designed for bonding surface-mounted devices to printed circuit boards prior to wave soldering. | Dispensing machine | 20ml, 30ml/tube |
| Stencil printing | 200g/tube, 20pcs/carton | ||
| Stencil printing | 360g/tube, 20pcs/ctn | ||
| JF-H832 | PUR Hot Melt Glue sealant | Mobile phones, smart phones, tablets, wearables | 30ml/pc |
For SMT bonding, stencil printing, and mobile electronics sealing.
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