SMT BGA IC Red Glue & PUR Hot Melt Glue

Adhesive products for SMT, BGA and IC assembly, surface-mounted device bonding, stencil printing, dispensing machine processes, and mobile electronics sealing. Available options include red glue epoxy adhesive and PUR hot melt glue sealant.

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SMT BGA IC Red Glue & PUR Hot Melt Glue

Adhesive products for SMT, BGA and IC assembly, surface-mounted device bonding, dispensing, stencil printing and mobile electronics sealing.

2 ProductsEpoxy adhesive and PUR sealant

2 Process RoutesDispensing and stencil printing

20 ml–360 gAvailable package options

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SMT BGA IC Red Glue and PUR Hot Melt Glue Series

Adhesive Series for Electronics Assembly

Adhesive materials for SMT bonding and device sealing

Jufeng Solder supplies SMT red glue for component bonding before wave soldering and JF-H832 PUR hot melt glue for sealing mobile and wearable electronics.

Two Adhesive Technologies

The series includes heat-curing epoxy red glue and a PUR hot melt sealing product.

Dispensing Process Options

SMT red glue is available in 20 ml and 30 ml tube options for dispensing equipment.

Stencil Printing Options

200 g and 360 g tube formats are available for stencil-printing processes.

SMT Component Bonding

Red glue supports component fixation on printed circuit boards before wave soldering.

Mobile Electronics Sealing

JF-H832 is intended for sealing and assembly work in phones, tablets and wearable devices.

Specification Confirmation

Final process conditions and equipment compatibility should be confirmed for the selected product.

Series Overview

Use the overview below for initial selection. Final curing, dispensing, printing and sealing parameters must be confirmed for the chosen adhesive.

How to Select

Choose red glue for SMT component fixation before wave soldering. Choose JF-H832 when the project requires a PUR hot melt sealant for compact mobile electronics.

Product Series

SMT BGA IC Red Glue & PUR Hot Melt Glue

Available Products

2 real adhesive products

Adhesive Types

Heat-curing epoxy adhesive / PUR hot melt sealant

Supported Processes

Dispensing / Stencil printing / Mobile electronics sealing

Red Glue Packaging

20 ml, 30 ml, 200 g or 360 g per tube

JF-H832 Packaging

30 ml per piece

Carton Information

200 g and 360 g red glue: 20 pieces per carton

Final Specification

Confirm by product specification

Available Adhesive Products

The series contains two real products. Red glue package sizes are grouped on one product page rather than duplicated as separate models.

Heat-Curing Epoxy Adhesive

SMT BGA IC Red Glue

A heat-curing epoxy adhesive for bonding surface-mounted devices to printed circuit boards before wave soldering, with options for dispensing and stencil printing.

20 ml / 30 ml dispensing tubes200 g / 360 g stencil-printing tubes

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PUR Hot Melt Sealant

JF-H832

A PUR hot melt glue sealant for mobile phones, smart phones, tablets, wearable devices and related compact electronics.

30 ml per pieceMobile electronics sealing

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Typical Applications

Product selection depends on the assembly process, equipment, substrate, package format and required sealing method.

Application 01SMT Component Bonding

Application 02BGA & IC Assembly

Application 03Dispensing & Stencil Printing

Application 04Mobile Electronics Sealing

Need an adhesive for your electronics process?

Contact Jufeng Solder to confirm the product type, package option, equipment compatibility and process requirements.

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