Solder Ball / BGA Reballing & Semiconductor Packaging
Solder Sphere for BGA & Semiconductor Packaging
A solder sphere series for BGA reballing, semiconductor packaging and related precision electronics work, covering lead-free, tin-lead and low-temperature alloy options.
Solder sphere solutions for BGA reballing and packaging work
Jufeng Solder supplies multiple solder ball alloy options for BGA reballing, semiconductor packaging, repair and precision assembly. Select the alloy according to your process temperature, compliance requirements and application target.
Multiple Alloy Options
The series covers SAC305, tin-lead, silver-bearing tin-lead and low-temperature alloy selections.
BGA Reballing Support
Each product is supplied as a solder sphere option for BGA reballing and related work.
Lead-Free and Tin-Lead Choices
Choose a suitable alloy family according to process and compliance needs.
Low-Temperature Option Available
Sn42Bi57Ag1 provides a lower-temperature alloy path for selected applications.
Specification-Based Supply
Ball size, packaging and other details should be confirmed by product specification.
Engineering Selection Support
Use the product overview for quotation and engineering review before final selection.
Series Overview
Use the overview below for initial selection. Final solder sphere diameter, packaging and process parameters should be confirmed for the selected product.
How to Select
Choose the alloy according to compliance requirements, process temperature, application environment and reliability needs. Then confirm the final solder ball diameter, packaging and process parameters by product specification.
Available Solder Ball Alloys
Each real product listed below uses the same mobile-friendly structure and is prepared for your website backend with details buttons temporarily set to #.
Lead-FreeSAC305 (Sn96.5Ag3.0Cu0.5)
A lead-free solder sphere based on the SAC305 alloy system for BGA reballing, semiconductor packaging and related electronics assembly work.
Tin-LeadSn62Pb36Ag2
A silver-bearing tin-lead solder sphere for BGA reballing, electronics repair and semiconductor packaging processes that require a tin-lead alloy option.
Tin-LeadSn63Pb37
A widely used tin-lead solder sphere for BGA reballing, repair and semiconductor packaging projects that require the Sn63Pb37 alloy composition.
Low-TemperatureSn42Bi57Ag1
A low-temperature lead-free solder sphere for BGA reballing and heat-sensitive electronics work using the Sn42Bi57Ag1 alloy composition.
Typical Applications
Solder sphere materials are commonly evaluated for BGA work, semiconductor packaging and related precision assembly tasks. Final suitability should be confirmed by process requirement.
Need help choosing the right solder sphere alloy?
Contact Jufeng Solder to confirm the suitable alloy, diameter, packaging and application direction for your BGA or semiconductor packaging project.
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