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    Home /Applications /company news /Joinspire Has Moved to a New Office in Shenzhen /

    Joinspire Has Moved to a New Office in Shenzhen

    2026-09-07

    A New Space for the Next Stage of Joinspire

    The move is a practical step forward for our growing team. With a better working space and improved internal coordination, we can respond to customer projects more efficiently and continue strengthening our technical, sales and service capabilities.

    Our daily operations remain unchanged. Customer communication, technical support, sample evaluation and international business will continue as usual from the new office.

    NEW OFFICE ADDRESS
    Room 1808, Tower A, Hongfa New Times Building
    Longhua District, Shenzhen, Guangdong, China
    Relocation completed on the morning of August 25, 2026.
    Better Collaboration
    The new workplace gives our sales, technical and operations teams a more efficient environment for project communication and customer support.
    Business as Usual
    Existing projects, orders, sample requests and technical services are not affected by the relocation.
     
     
     

     

    Continuing to Support Advanced Electronics and Semiconductor Applications

    From our new Shenzhen office, Joinspire will continue working with customers on advanced interconnection and packaging materials for electronics, semiconductor and power device applications.

    Silver & Copper Sintering Materials
    Conductive Silver & Copper Pastes
    Via-Filling Copper Paste for TGV & HDI
    Advanced Packaging Interconnection Materials
    Power Semiconductor Packaging Materials
    Customized Material Solutions

    Welcome to Visit Joinspire

    We appreciate the continued trust of our customers and partners. We look forward to welcoming you to our new office in Shenzhen and discussing future projects in person.

    Contact Joinspire
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