Jufeng Solder Development History

Since 2006, Jufeng Solder has grown from a solder materials manufacturer into a supplier of solder, conductive and sintering materials for global electronics manufacturing.

Key Milestones

A cleaner timeline of Jufeng's growth from solder manufacturing to advanced conductive and sintering materials.

Company Established

Shenzhen Jufeng Solder Co., Ltd. was established. SPECTRO testing equipment was introduced, and the company started the transition from lead-based to lead-free solder products.

Overseas Export Started

Jufeng began exporting soldering products to overseas markets, laying the foundation for long-term international supply.

Industry Association & Hong Kong Company

Jufeng joined the China Electronic Tin Solder Association. Jufeng Trading Limited was founded in Hong Kong to support international business development.

European Market Development

RoHS and REACH-related certification support was strengthened, supporting Jufeng's entry into the European market.


ISO 9001 Quality System

Jufeng was certified by ISO 9001:2008 and declared a non-use policy for conflict minerals.

Sn-Bi Solder Wire Development

The company developed Sn-Bi series flux-cored solder wire, expanding product options for low-temperature soldering applications.

Indium Series & Industry Memberships

Jufeng developed indium series flux-cored solder wire and joined ITA and IPC, strengthening industry exchange and technical development.

ISO 9001:2015 & High-Tech Recognition

Jufeng was certified by ISO 9001:2015 and recognized as Shenzhen High Technology Expertise.

Solder Powder & India Expansion

Jufeng joined SMTA, started developing low alpha solder powder, and established Jufeng Solder International Private Limited. KTE Jufeng Solder PVT Ltd. was founded in India for solder powder production.

IATF 16949 & Distribution Cooperation

Jufeng was certified by IATF 16949:2016 and deepened cooperation with MG Chemicals, supporting distribution authorization in China and India.

Power Module Die Attach Materials

The company focused on high-performance power module die attach materials, extending its portfolio toward advanced electronic packaging applications.

Silver Sintering Paste Development

Jufeng launched pressure-assisted silver sintering paste and pressureless silver sintering paste for electronic packaging and power device applications.

Specialized Enterprise & Mass Production Line

Jufeng was recognized as a Specialized and Sophisticated Enterprise and built a mass production line for silver sintering paste.

From Solder Materials to Advanced Electronic Materials

Jufeng Solder continues to support reliable interconnection for electronics assembly
semiconductor packaging and industrial manufacturing worldwide.