Solder Ball / BGA Reballing
Solder Ball / BGA Reballing
Solder balls for BGA reballing, semiconductor packaging, electronic repair, and precision interconnect applications. Multiple alloy systems are available with standard diameter ranges and low alpha options for sensitive electronic applications.
Solder balls for BGA reballing and precision interconnects.
This solder ball series includes SAC305 lead-free solder balls, Sn-Pb-Ag solder balls, Sn-Bi-Ag low-temperature solder balls, and Sn-Pb solder balls. Low alpha solder ball options are available for applications requiring alpha emission control.
Low alpha solder ball available
Low alpha solder balls can be supplied for semiconductor packaging and sensitive electronic interconnect applications.
Multiple Alloy Choices
Includes SAC305, Sn62Pb36Ag2, Sn42Bi57Ag1, and Sn63Pb37 alloy options.
Diameter Range
SAC305 supports 0.05mm to 1.8mm. Other listed alloy options support diameter ≥0.1mm.
Low Alpha Supply
Low alpha and ultra-low alpha options are available for sensitive packaging requirements.
Standard Packaging
Available packaging options include 250k/pack and 1000k/pack.
Available solder ball models
Each alloy is displayed as a separate product-style item. The image URL is temporarily reused and can be replaced later with solder ball, BGA reballing, or packaging photos.
Quick technical matrix
For quick alloy comparison, the table below summarizes the model, diameter and packaging information.
| Alloy Model | Diameter | Packaging | Low Alpha Option |
|---|---|---|---|
| SAC305 (Sn96.5Ag3.0Cu0.5) | 0.05mm-1.8mm | 250k/pack, 1000k/pack | Low alpha solder ball available: <0.01 cph/cm² / <0.002 cph/cm². |
| Sn62Pb36Ag2 | ≥0.1mm | 250k/pack, 1000k/pack | |
| Sn42Bi57Ag1 | ≥0.1mm | 250k/pack, 1000k/pack | |
| Sn63Pb37 | ≥0.1mm | 250k/pack, 1000k/pack |
For BGA reballing and precision electronic interconnects.
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