Sn96.5Ag3.0Cu0.5 (SAC305) Lead-Free Solder Paste
Sn96.5Ag3.0Cu0.5 (SAC305)
Lead-Free Solder Paste
SAC305 lead-free solder paste for reliable SMT assembly and precision printing. Available in jar, syringe, and cartridge packaging for SMT printing, dispensing, rework, and production soldering processes.
Stable solder paste for lead-free assembly.
Sn96.5Ag3.0Cu0.5 (SAC305) Lead-Free Solder Paste is supplied for SMT printing, precision dispensing, rework, and assembly processes requiring stable wetting, controlled particle size, and reliable flux performance.
Clean Soldering
No-clean and water-soluble flux systems are available for different process requirements.
Particle Size Options
Multiple powder types support standard printing, fine-pitch printing, and precision applications.
Low Void Option
Low void and low splattering formulations can be selected for process stability.
Flexible Packing
Jar, syringe, and cartridge packing options support sampling and production use.
Quick specification
| Product Name | Sn96.5Ag3.0Cu0.5 (SAC305) Lead-Free Solder Paste |
| Alloy Model | Sn96.5Ag3.0Cu0.5 (SAC305) |
| Melting Point | 217°C |
| Particle Size | Type 3, Type 4, Type 5, Type 6, Type 7 |
| Particle Size Range | Type 3: 25–45μm; Type 4: 20–38μm; Type 5: 15–25μm; Type 6: 5–15μm; Type 7: 2–11μm. |
| Flux Option | No-clean / Water-soluble; low void, low splattering; halide/halogen-free options; ROL0, ROL1, ROM0, ROM1, ORL0, ORL1 available. |
| Packaging | 250g/500g per jar; 20 bottles per carton (34.5×27.5×23.5cm); 10cc/30cc/100g/200g per syringe; 600g/700g per cartridge. |
For SMT and precision soldering processes.
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