Sn99.95 Lead-Free Pure Tin Ingot
Sn99.95
Lead-Free Pure Tin Ingot
Tin ingot is a high-purity, lead-free raw material with a silver-white surface, soft texture, good ductility and excellent malleability. It is widely used for solder wire, solder bar, solder powder and solder paste production.
High-purity tin for solder and alloy production.
Sn99.95 tin ingot is used as a raw material for solder wire, solder bar, solder powder and solder paste production.
It offers high purity, good fluidity, strong wetting performance and oxidation resistance while helping reduce tin slag. A metal block doing honest industrial work, unlike half the web pages selling it.
High Purity
Tin content reaches up to 99.95% for stable industrial use.
Good Fluidity
High fluidity helps enhance diffusion and solder production consistency.
Oxidation Resistance
Strong oxidation resistance helps reduce slag during processing.
Lead-Free Material
Made from high-quality pure tin without intentional lead content.
Raw material for solder and industrial alloys.
Tin ingot is used in electronics, solder production, alloy manufacturing and other industrial fields.
Core data for purchasing and material review.
Simplified product data for quick RFQ and raw material selection.
| Item | Data | Remark |
|---|---|---|
| Specification | Sn99.95 | Lead-free pure tin ingot |
| Appearance | Lucent, no dirt on surface | Silver-white surface |
| Melting Point | 232℃ | Pure tin reference |
| Density | 7.29g/cm³ | Reference value |
| Gross Weight | 25kg / ingot, 25kg / box | Standard package |
| Carton Dimension | 39 × 12 × 8cm | Length × width × height |
| MOQ | 1 ton | Standard MOQ |
| Production Capacity | 200 tons / month | Factory supply capacity |
Sn99.95 composition reference.
Main composition and impurity limits for material review.
| Sn | Ag | Cu | Pb | Sb | Bi | Zn | Fe | Al | As | Cd |
|---|---|---|---|---|---|---|---|---|---|---|
| 99.95±0.5 | <0.002 | <0.0002 | <0.001 | <0.02 | <0.03 | <0.005 | <0.002 | <0.02 | <0.03 | <0.002 |
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