Solder spheres for PBGA, CBGA, TBGA, µBGA, and flip-chip applications. The solder spheres are made using a proprietary manufacturing process that provides consistently high sphericity and accurate diameters.
Solder Sphere is made from pure metals, to produce exact alloy compositions. We developed and produced under a strict research and quality control policy.the alloy is Sn63Pb37,Sn96.5ag3.0Cu0.5
Our Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip applications are made by the UMT ( Ultra Micron Technology) to ensure spheres with accurate diameters, bright, shiny surface finishes; and high sphericity. We have own developed technology which reduces raw material cost, accordingly competitive price make users benefited. With our newest in-house production machine, we can comply with customer’s request of various sizes. Solder Sphere is available for customers' specifications.