Keywords: Solder Wire, Solder Bar, Solder Paste, Solder Sphere, Solder Preform, Solder Flux, Blister Package, Jar Package, Solder Powder, Solder Iron...

  • Sn96.5ag3.0Cu0.5 Solder Bar
  • Sn96.5ag3.0Cu0.5 Solder Bar
  • Sn96.5ag3.0Cu0.5 Solder Bar

Sn96.5ag3.0Cu0.5 Solder Bar

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Products Details

Our Sn96.5Ag3.0Cu0.5 solder bar is a commonly used product by adoption of lead-free soldering technique. It features relatively high cost, but bright solder joints and outstanding performance. Our company has achieved both SGS certificate and RoHS certificate for this type product.

The lead content of our solder bar is generally less than 100ppm. This product is composed of 96.5% tin, 3% silver, and 0.5% copper.Due to the adoption of high-purity raw materials, our product can offer superb fluidity during the soldering process. It can significantly reduce such technical problems as bridging, icicle, and some others. It is ideal for both wave soldering and dip soldering processes, which have high demand for environmental protection.


Scope of Application
The Sn96.5Ag3.0Cu0.5 solder bar can be used for the soldering of the precise computer chips, mobile phone chips, stainless steel products, LED, printed circuit board (PCB), and a variety of high-precision electronic circuit boards, among others. Meanwhile, it is suitable for the restoration of mini-sized electronic equipment.


Technical Parameters

SpecificationSn99-Ag3.0-Cu0.5
AppearanceLucent, no dirt on surface
Dimension of Solder Bar (L×W×T×W)32cm×1.8cm×1.5cm×0.7kg/pc
Weight of Solder Bar20kg/ctn.
Chemical Components
SnAgCuPbSbBiZnFeAlAsCd
Residue Content3.0±0.20.5±0.2<0.1<0.1<0.1<0.001<0.02<0.001<0.03<0.002