Keywords: Solder Wire, Solder Bar, Solder Paste, Solder Sphere, Solder Preform, Solder Flux, Blister Package, Jar Package, Solder Powder, Solder Iron...

  • Sn99Ag0.3Cu0.7 High Melting Point Lead Free Solder Wire
  • Sn99Ag0.3Cu0.7 High Melting Point Lead Free Solder Wire

Sn99Ag0.3Cu0.7 High Melting Point Lead Free Solder Wire

Products Details

Our Sn99Ag0.3Cu0.7 lead free solder wire is also known as SAC0307 lead-free solder with high melting point. Its composition is 99% tin, 0.3% silver, and 0.7% copper. Its lead content is usually lower than 100ppm on basis of customer needs.

The flux is used as the core of this lead-free solder wire produced by Jufeng Solder Company. Its dosage is normally 2%. The wire diameter can reach over 0.15mm. The material selection process strictly conforms to both RoHS Directive and SS-00259 standards. Moreover, our product is manufactured by adoption of a high standard of technological process from the raw material smelting, mixing, inspection, to perfusion.

Our environmentally-friendly lead free solder adopts two different raw materials, including the electrolytic lead with 99.99% refined-lead content, as well as the No.1 tin with its purity of over 99.97%. So far, our lead-free solder bar has been exported to such countries as Poland,Argentina, Peru, Pakistan,Italy, and more. In addition, we are seeking agents on a global scale. Please don’t hesitate to contact us, if you are interested in our product.

Product Description and Chemical Components

AppearanceLucent, no dirt on surface
PackingG.W.: 500g/roll, 10kg/ctn.
Chemical Components
Residue Content0.3±0.10.7±0.2<0.1<0.1<0.06<0.001<0.02<0.001<0.03<0.002

Physical Properties

Alloy ComponentMelting Point, ℃Tensile Strength, g/cm3Rigidity HBHeat Conductivity M.S.KTensile Strength, MPaElongation Rate, %Electric Conductivity, %

The Sn99Ag0.3Cu0.7 solder wire is applicable for precise LED and mobile phone chips.

Related Names
Rosin Core Solder Wire | Industrial Soldering Supplies | Metal Soldering Rod