Our Sn99Ag0.3Cu0.7 lead free solder wire is also known as SAC0307 lead-free solder with high melting point. Its composition is 99% tin, 0.3% silver, and 0.7% copper. Its lead content is usually lower than 100ppm on basis of customer needs.
The flux is used as the core of this lead-free solder wire produced by Jufeng Solder Company. Its dosage is normally 2%. The wire diameter can reach over 0.15mm. The material selection process strictly conforms to both RoHS Directive and SS-00259 standards. Moreover, our product is manufactured by adoption of a high standard of technological process from the raw material smelting, mixing, inspection, to perfusion.
Our environmentally-friendly lead free solder adopts two different raw materials, including the electrolytic lead with 99.99% refined-lead content, as well as the No.1 tin with its purity of over 99.97%. So far, our lead-free solder bar has been exported to such countries as Poland,Argentina, Peru, Pakistan,Italy, and more. In addition, we are seeking agents on a global scale. Please don’t hesitate to contact us, if you are interested in our product.
Product Description and Chemical Components
|Appearance||Lucent, no dirt on surface|
|Packing||G.W.: 500g/roll, 10kg/ctn.|
|Alloy Component||Melting Point, ℃||Tensile Strength, g/cm3||Rigidity HB||Heat Conductivity M.S.K||Tensile Strength, MPa||Elongation Rate, %||Electric Conductivity, %|
The Sn99Ag0.3Cu0.7 solder wire is applicable for precise LED and mobile phone chips.
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