Keywords: Solder Wire, Solder Bar, Solder Paste, Solder Sphere, Solder Preform, Solder Flux, Blister Package, Jar Package, Solder Powder, Solder Iron...

  • Sn99Ag0.3Cu0.7 High Melting Point Lead Free Solder Bar
  • Sn99Ag0.3Cu0.7 High Melting Point Lead Free Solder Bar
  • Sn99Ag0.3Cu0.7 High Melting Point Lead Free Solder Bar

Sn99Ag0.3Cu0.7 High Melting Point Lead Free Solder Bar

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Products Details

Our Sn99Ag0.3Cu0.7 lead free solder bar is also known as SAC0307 lead-free solder with high melting point. Its composition is 99% tin, 0.3% silver, and 0.7% copper. Its lead content is usually lower than 100ppm on basis of customer needs.

Our environmentally-friendly lead free solder adopts two different raw materials, including the electrolytic lead with 99.99% refined-lead content, as well as the No.1 tin with its purity of over 99.97%. So far, our lead-free solder bar has been exported to such countries as Poland,Argentina, Peru, Pakistan,Italy, and more. In addition, we are seeking agents on a global scale. Please don't hesitate to contact us, if you are interested in our product.


Product Description and Chemical Components

SpecificationSn99-Ag0.3-Cu0.7
AppearanceLucent, no dirt on surface
Packing10kg/ctn.
Chemical Components
SnAgCuPbSbBiZnFeAlAsCd
Residue Content0.3±0.10.7±0.2<0.1<0.1<0.06<0.001<0.02<0.001<0.03<0.002


Physical Properties

Alloy ComponentMelting Point, ℃Tensile Strength, g/cm3Rigidity HBHeat Conductivity M.S.KTensile Strength, MPaElongation Rate, %Electric Conductivity, %
Sn99Ag0.3Cu0.72307.4964324816.0


Applications
The Sn99Ag0.3Cu0.7 solder bar is ideal for use in the hi-tech wave soldering machines as well as the small-sized tin furnaces. Moreover, our product can be applied in the printed circuit board (PCB) and the stainless steel products.


Related Names
Rosin Core Solder Wire | Industrial Soldering Supplies | Metal Soldering Rod