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  • Sn63Pb37 No-Clean Tin Lead Solder Bar
  • Sn63Pb37 No-Clean Tin Lead Solder Bar
  • Sn63Pb37 No-Clean Tin Lead Solder Bar

Sn63Pb37 No-Clean Tin Lead Solder Bar

Products Details

The Sn63Pb37 no-clean tin lead solder bar can be applied in the high-precision electronic products as well as the other manufactured goods which call for precise soldering work. It can be also used for the soldering of common electronic products. Moreover, our product is ideal for use in the automotive and electronics industries. It is dedicated for the manual soldering of printed circuit boards and some others.

The Sn-37Pb is the most common type of tin-lead alloy solder, which features the maximum dosage and the maximum demand. Sn63Pb37 represents that the alloy of solder contains the 63% tin content and the 37% lead content.With the melting point of 183 degrees Celsius and the working temperature of 205 degrees Celsius, this Sn63Pb37 no-clean tin lead solder wire and solder bar can offer quite stable welding performance.

When applied in the wave soldering ovens, the common solder bar can often produce a large amount of solder splash or unmelted solder. So far, our Sn63Pb37 solder bar has been exported to United States, Russia, Germany, India, and Brazil, among other countries. We are also looking for agents on a global scale.

Product Features
1. Favorable Fatigue Resistance and Outstanding Soldering Performance
2. Ultra High Electrical Conductivity
3. Mid-Temperature Soldering
The manufactured product belongs to the mid-temperature solder, which is characterized by nice softness, and wonderful wetting property. 
4. Benefits from Activated Rosin Flux
The solder bar is doped with an appropriate amount of activated rosin flux, thus providing distinguished soldering effect, fast soldering speed, as well as extremely good fluidness.
5. Ultra Strong Oxidation Resistance
Due to the addition of anti-oxidant element, our Sn63Pb37 solder bar can give strong resistance to oxidation. The mid-temperature solder is difficult to be softened, and its anti-oxidant capacity is greatly enhanced.

Technical Parameters

63±0.5<0.1<0.08Residue Content<0.1<0.1<0.001<0.02<0.001<0.03<0.002

Related Names

Soft Solder Wire | Wave Soldering Flux | Soldering Metals