JF8360C LED solder paste is specially developed for LED soldering operations. JF8360C uses a proprietary formulation of organic activation mixtures.Some proprietary additives are added to reduce the surface tension between solder mask and solder filling, thereby significantly reducing the probability of solder ball formation.It is suitable for the welding of LED chip and flip-chip bonding process, for the solder bridge connecting with sensitive plate design or the need to perform probe test and the applicationwith high requirement of low solder ball formation rate.
This product is used in LED display, LED power supply and LED peripheral products. Light source (bulb, tube lamp, panel lamp, indicator lamp)
Storage and Application
To ensure normal operation of solder paste it must be stored in t 1 to 10 ° C temperature environment.
Shelf life: 6 months (Sealed and Stored at 1 ℃-10 ℃) , 7 days( sealed and stored at room temperature 25 + 2 ℃)
Before using, solder paste should be placed at room temperature 25°C for at least 4 to 8 hours taken out of the refrigerator
To ensure uniformity, please use a blender to fully stir about 90~120 seconds (if manually stir, it should be 5 to 7 minutes).
No to store used and unused solder paste together. It is recommended to use up the unsealed solder paste within 24 hours
If reuse the solder paste on the next day,first use the new one, and then old one, stir the old and new one at a ratio of 1:2 and mix them together little by little in small quantities.